Capacitor Array Metal Frame Segmentation for Short Circuit Prevention

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Solution Overview

Problem

Multilayer capacitors used in automotive applications face challenges in thermal, electrical, and mechanical reliability due to vibration and deformation, leading to potential short circuits when mounted on substrates, especially in modular electronic components where metal frames can contact land patterns of different polarities.

Innovation Solution

The electronic component design includes a capacitor array with multiple multilayer capacitors arranged in a specific direction, connected by first and second metal frames with support and mounting portions, and cutting portions to prevent short circuits, ensuring high capacitance, durability, and reliability by maintaining a secure connection to the substrate while allowing for some distortion without contacting opposing polarities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If modular electronic components are manufactured to be elongated with metal frames, then high capacity can be implemented by stacking multilayer capacitors, but the metal frame position may be distorted during mounting causing contact with land patterns of different polarities resulting in short circuit defects

Engineering Contradiction:
ImprovecapacitanceVSAvoidshort circuit prevention
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The mounting portion of the metal frame is divided into multiple distinct portions: a first mounting portion and a second mounting portion separated by a predetermined distance. This segmentation ensures that even if the frame distorts during mounting, the separated portions prevent simultaneous contact with land patterns of different polarities, thereby preventing short circuits while maintaining the elongated modular structure for high capacitance

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An insulating structure is introduced as an intermediary element between the metal frame and the substrate. This insulating structure covers the metal frame and prevents direct contact between the frame and land patterns of different polarities, serving as a mediator that eliminates the short circuit risk while allowing the elongated modular design to maintain high capacitance

Inventive Principle:
Principle #24Intermediary (Mediator)

2Strength

If the metal frame is extended to provide mounting portions, then the capacitor can be securely mounted on the substrate, but the frame may contact land patterns of different polarities causing short circuits

Engineering Contradiction:
Improvemounting strengthVSAvoidshort circuit prevention
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The mounting portion is segmented into multiple separate portions positioned at different locations on the metal frame. This segmentation allows the frame to be securely mounted through multiple attachment points while preventing any single portion from contacting land patterns of different polarities, thus maintaining both mounting strength and short circuit prevention

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An insulating structure is introduced as a mediator between the metal frame and the substrate surface. This insulating layer maintains secure mounting capability while electrically isolating the metal frame from land patterns of different polarities, preventing short circuits

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design enhances thermal and mechanical reliability, prevents short circuits during substrate mounting, and maintains sufficient fixing strength by optimizing the area ratio of cutting to mounting portions, effectively addressing the reliability and durability needs of automotive applications.

Implementation Method 1

A conductive adhesive portion may be provided between the first external electrodes and the first support portion, and the conductive adhesive portion may be provided between the second external electrodes and the second support portion

Methodology Applied
Scientific EffectAdhesive bonding: Adhesive

Data Source

PatentUS10529496B1Electronic component including a capacitor array
Publication Date: 2020.01.07 SAMSUNG ELECTRO MECHANICS CO LTD
  • US10529496B1 patent drawing
  • US10529496B1 patent drawing
  • US10529496B1 patent drawing

AI summary

An electronic component includes: a capacitor array including a plurality of multilayer capacitors which are sequentially arranged in a first direction, and first and second metal frames disposed on both side surfaces of the capacitor array and connected to first and second external electrodes of the plurality of multilayer capacitors, respectively; the first and second metal frames include first and second support portions, and first and second mounting portions, respectively; and the first and second mounting portions include first and second portions opposing each other toward the center of the capacitor array, and third and fourth portions positioned outside the first and second portions, respectively, and a length of each of the first and second portions is shorter than a length of each of the third and fourth portions.