Multiple Fixed Capacitors TRIZ Cases

Stacked power and ground electrodes in a wiring substrate lower source impedance while maintaining high wiring density.

A high voltage filter uses specific terminal arrangements across multiple capacitive elements to reduce effective inductances.

Narrower mounting portions prevent contact with adjacent land patterns, reducing acoustic noise and short circuit risks.

A film capacitor transfers heat from the bus bar to the lid member via a protrusion contact, reducing damage risk during high-current operation.

Segmented textile capacitors connect via flexible boards to resolve the contradiction between fixed voltage levels and expansion capability.

Alternating electrode regions reduce thermal shrinkage stress and electrostrictive forces to prevent cracking during high-layer stacking.

Segmented busbar system conducts heat from capacitor to cooling area via meandering metal bodies.

An integrated capacitor and power module uses an intermediate cold plate to circulate fluid for thermal management.

Segmented metal frame mounting portions prevent short circuits from distortion while maintaining fixing strength.

Segmented metal frame mounting portions prevent short circuits during substrate mounting by isolating distortion risks across asymmetric structural zones.

A composite resin material combines phenylene ether and polyester resins to form dielectric films for film capacitors.

Segmented components separated by an open mesh layer reduce crack transmissibility, enabling higher capacitance at elevated working voltages.

A capacitor design uses a bypass electrode plate to electrically bypass the second electrode plate, lowering self-inductance.

Bearing rings separate capacitor housings from carriers, reducing assembly complexity and production costs while maintaining electrical isolation.

A variable capacitance element uses segmented resistance elements to route control voltage while handling electrical surges.

Longitudinal edge termination on MLCCs connects mixed-size components to a shared lead frame, increasing capacitance density while reducing assembly complexity.

A film capacitor design couples bus bar terminals to a fixation portion for stable mold positioning during resin encapsulation.

Segmented internal electrode structures in multilayer ceramic capacitors reduce acoustic noise while preventing cracks during stacking.

Alternating laminated portions merge distinct capacitor units to lower PDN impedance across broad frequency ranges while reducing mounting space.

Stacked multilayer capacitors use a shortened lower unit and metal frames to improve mechanical reliability without increasing mounting area.

A conductive terminal uses a curved inner electrode part to maintain pressure contact with chip component terminals without solder.

Matrix arrangement of segmented ceramic units distributes creeping distance to reduce high-voltage discharge while maintaining small footprint.

Multiple metal-insulator-metal capacitors use varying dielectric thicknesses to achieve distinct capacitance values per unit area.

A connector structure integrates a capacitance device to absorb electrical surges during power transmission between detachable external devices.

Outer connecting conductors regulate equivalent series resistance in multilayer capacitor arrays, preventing impedance drops at resonance frequencies.

A three-phase capacitor uses three cylinders connected in a triangular delta arrangement with internal series capacitors.

A film capacitor uses a spaced conductive covering to cancel magnetic field changes and reduce equivalent series inductance.

Opposing capacitor orientations cancel vibration modes, preventing acoustic noise and sensor malfunction in mold-resin-encapsulated boards.

A voltage dividing capacitor uses a short insulation tube to support the movable end of the capacitor series.

A capacitor assembly structure uses an insulative package body to partially cover capacitors while exposing positive portions for electrical connection.

A thin film capacitor design uses a connection electrode with larger crystal grains to stabilize electrical connections between internal and external electrodes.

Segmented electrode arrays resolve the contradiction between charge speed and storage capacity by increasing surface area without compromising response time.

A modular ultracapacitor system uses heat sinks and busbars to dissipate thermal energy from series-connected modules.

Replacing rigid lead frames with a flexible substrate minimizes mechanical shock damage while maintaining high capacitance density.

Extended metal frames on a support plate absorb piezoelectric vibrations, reducing acoustic noise transfer to circuit boards.

A modular intermediate circuit design segments capacitor modules in a chain to minimize parasitic inductance and optimize current flow.

A capacitor uses a polarizable molecular material between electrodes to boost dielectric permittivity and breakdown strength.

Micro transfer printing assembles ultra-thin active components onto flexible substrates, reducing non-active semiconductor area and system size.

Alternately laminated multilayer capacitors with perpendicular internal electrodes alter deformation patterns to reduce acoustic noise.

Integrating a paraelectric ceramic chip beneath a multilayer ceramic capacitor blocks acoustic noise while maintaining low equivalent series inductance.

Parallel chip component arrangement reduces circuit board footprint while maintaining electrical connectivity through conductive terminals.

Integrating laminated capacitors into connector housings reduces overall weight and size while maintaining electrical connectivity.

Solder surface tension stabilizes the multilayer ceramic capacitor alignment while the ceramic chip absorbs vibrations to reduce acoustic noise.

Segmented internal electrode structure increases current-carrying paths to lower resistance and boost the Q-factor of multilayer capacitors.

A stacked multilayer capacitor design uses metal frames and enlarged bonding band portions to enhance mechanical stability.

Thicker-than-wide ceramic geometry and side-surface insulation prevent toppling and short-circuits when stacking layers increases capacitance.

A capacitor design uses stacked and perpendicular lead-out terminals to minimize stray inductance through magnetic field interactions.

Side recesses and rounded corners on capacitor bodies improve adhesion to resin fillers, reducing warpage and thermal stress in wiring substrates.

Segmented terminals bridge heat from both capacitor sides to a single cooling device, preventing lower-side overheating without adding installation space.

Merging capacitor structures with bump interconnects reduces susceptibility to process variations while enabling filtering up to 73 GHz.