Flexible Substrate MLCC Array for Mechanical Shock Resistance
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Solution Overview
Problem
Existing capacitors, such as film and electrolytic types, are inadequate for harsh environmental conditions and mechanical shocks, while multilayered ceramic capacitors (MLCCs) stacked with lead frames are prone to mechanical failure due to their rigidity.
Innovation Solution
A large packaged array of MLCCs is assembled on a flexible substrate, allowing for improved resilience to mechanical shocks by enabling the capacitors to be mounted on a flexible circuit with conductive traces and termination traces, which can be folded or rolled for compact packaging and enhanced durability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If MLCCs are stacked into large rigid arrays using lead frames to achieve higher capacitance, then the capacitor can withstand higher temperatures, but the large mass of the leaded stack causes the stack to be more prone to failures caused by mechanical shock
Solution Approach 1:
The patent replaces rigid lead frames with a flexible substrate that can bend and absorb mechanical shock energy. The flexible substrate supports the MLCC array while accommodating thermal expansion and contraction, preventing the mechanical failures that occur in rigid constructions during temperature cycling and shock events.
Solution Approach 2:
The flexible substrate introduces dynamic flexibility to the capacitor assembly, allowing it to adapt to mechanical stresses and thermal changes. This dynamic capability enables the structure to withstand both high temperatures and mechanical shocks by flexing rather than fracturing under stress.
2Quantity of substance
If film or electrolytic capacitors are used to create large capacitor devices, then large capacitance can be achieved, but they perform poorly in harsh environmental conditions such as elevated temperatures
Solution Approach 1:
The patent merges the high capacitance capability of film/electrolytic capacitors with the temperature resistance of MLCCs by mounting multiple MLCCs in parallel on a flexible substrate. This combination achieves the desired large capacitance value while maintaining excellent temperature resistance, as each MLCC individually withstands harsh environmental conditions.
3Reliability
If MLCCs are mounted on a flexible substrate instead of rigid lead frames, then resilience to mechanical shocks is improved, but the structural robustness against bending forces during assembly is reduced
Solution Approach 1:
The flexible substrate acts as a cushioning element that absorbs and dissipates mechanical shock energy before it reaches the MLCCs. By positioning the flexible substrate between the MLCCs and the external environment, the system provides beforehand protection against mechanical failures during assembly and operation.
Data Source
AI summary
An improved high capacitance module for multi-layer ceramic capacitors is described. The module contains a flexible substrate comprising at least one first conductive trace and at least one second conductive trace. A first termination trace is in electrical connection with each first trace and a second termination trace is in electrical connection with each second trace. Each capacitor comprises interleaved conductors wherein alternate conductors are terminated to a first external termination and adjacent conductors are terminated to a second external termination. Each capacitor is mounted on the substrate with the first termination in electrical contact with the first trace and the second termination in electrical contact with the second trace. A housing with the substrate is received in the housing. A first lead tab is in electrical contact with the first termination wherein the first lead tab extends from the housing.