Stacked Multilayer Capacitor with Metal Frames for Vibration Resistance
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Solution Overview
Problem
Multilayer capacitors used in vehicle power systems face challenges in thermal resistance, electrical reliability, and resistance to vibrations and deformation, particularly in the demand for high capacitance and improved mechanical stability.
Innovation Solution
A stack-type electronic component design featuring first and second multilayer capacitors with opposing external electrodes and metal frames, where the band portions on the bonding surface have a larger area than those on other surfaces, and conductive bonding portions enhance adhesion and mechanical stability, allowing for improved resistance to vibrations and deformation while maintaining high capacitance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multilayer capacitors are stacked vertically to increase capacitance, then high capacitance is achieved, but resistance to vibrations and deformation deteriorates
Solution Approach 1:
The capacitor array is divided into multiple individual multilayer capacitors that are vertically stacked and independently supported by metal frames. Each capacitor is segmented from others through spacing, allowing individual vibration resistance while maintaining collective high capacitance through the array configuration.
Solution Approach 2:
The structure combines multilayer capacitors with metal frames and conductive bonding portions to create a composite assembly. The metal frames provide mechanical strength and vibration resistance, while the capacitors provide electrical function, achieving both high capacitance and improved resistance to vibrations and deformation.
2Strength
If band portions are enlarged on bonding surfaces to improve bonding strength, then adhesion force between components increases, but device complexity increases
Solution Approach 1:
The band portions are selectively enlarged only at the bonding surfaces where adhesion is required, while maintaining standard dimensions elsewhere. This localized modification improves bonding strength between the capacitor and metal frame without unnecessarily increasing the overall device complexity.
Data Source
AI summary
An electronic component includes a capacitor array including a plurality of multilayer capacitors disposed in a vertical direction, among the multilayer capacitors, adjacent multilayer capacitors including opposing external electrodes, including band portions bonded to each other, the external electrodes being disposed in such a manner that a band portion disposed on a bonding surface has an area relatively larger than an area of a band portion disposed on a further surface, and a pair of metal frames, each including a vertical portion bonded to a head portion of an external electrode of a lowermost multilayer capacitor and a mounting portion bent at a lower end of the vertical portion to extend.