Composite Electronic Component with Ceramic Chip for Acoustic Noise Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer ceramic capacitors in electronic devices generate acoustic noise due to piezoelectric vibrations, and existing solutions that reduce noise by using a printed circuit board below the capacitor increase equivalent series inductance (ESL), leading to undesirable vibration transmission.
Innovation Solution
A composite electronic component comprising a multilayer ceramic capacitor and a ceramic chip with paraelectric material, where the ceramic chip is mounted on the lower portion of the capacitor, and electrodes are disposed within the ceramic chip to shorten the current path, thereby reducing acoustic noise without increasing ESL.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a printed circuit board is used below a multilayer ceramic capacitor to decrease acoustic noise, then acoustic noise is reduced, but equivalent series inductance (ESL) is increased
Solution Approach 1:
A ceramic chip is introduced as an intermediary component between the multilayer ceramic capacitor and the printed circuit board. This ceramic chip acts as a mediator that blocks vibration transmission to reduce acoustic noise, while its thin profile and conductive structure maintain short current paths to keep ESL low. The ceramic chip specifically addresses the contradiction by providing vibration isolation without the harmful side effect of increasing inductance.
Solution Approach 2:
The solution employs a composite structure combining the multilayer ceramic capacitor, ceramic chip, and printed circuit board into an integrated assembly. This composite electronic component allows the different materials to work together synergistically - the ceramic capacitor provides capacitance, the ceramic chip provides vibration damping, and the PCB provides electrical connection, achieving both noise reduction and low ESL performance.
2Object-affected harmful factors
If the current path is extended to reduce acoustic noise, then acoustic noise is decreased, but equivalent series inductance (ESL) is increased
Solution Approach 1:
The ceramic chip serves as an intermediary that decouples the vibration isolation function from the electrical connection function. By placing the ceramic chip directly beneath the capacitor with minimal separation, vibration transmission is blocked while the current path remains short, preventing ESL increase despite the added component.
Solution Approach 2:
The ceramic chip is positioned specifically at the location where vibration transmission occurs (directly beneath the capacitor), providing localized vibration isolation. This targeted approach allows noise reduction without requiring extensive modifications to the overall current path structure, maintaining short electrical connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively decreases acoustic noise and maintains low ESL, improving the reliability and performance of electronic devices by blocking vibrations and optimizing the current path within the composite electronic component.
Implementation Method 1
Since the dielectric layer as described above has piezoelectric and electrostrictive properties, when a direct current (DC) or alternating current (AC) voltage is applied to the multilayer ceramic capacitor, a piezoelectric phenomenon may occur between the internal electrodes, thereby generating vibrations.
Implementation Method 2
The second ceramic body may contain a paraelectric material.
Data Source
AI summary
A composite electronic component includes a composite body that includes a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes are disposed on both end portions of the first ceramic body. The ceramic chip is disposed on a lower portion of the multilayer ceramic capacitor and includes a second ceramic body and first and second terminal electrodes disposed on both end portions of the second ceramic body and connected to the first and second external electrodes, respectively. A plurality of electrodes are disposed in the second ceramic body.