Multilayer Printed Capacitors for Phased-Array Antennas
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Solution Overview
Problem
The size and cost of traditional phased-array antenna systems are prohibitive for many applications due to the large number of radiating elements required, making it difficult to construct ultra-thin and small devices using conventional assembly techniques, and inefficient use of semiconductor material.
Innovation Solution
Micro transfer printing technology is used to efficiently assemble phased-array antenna systems by transferring ultra-thin and small active components onto flexible substrates, reducing the amount of non-active semiconductor area and enabling high-throughput assembly of high-performance semiconductor devices onto various substrate materials, including plastics and metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional assembly techniques are used to assemble phased-array antenna systems, then the system can be constructed, but the size and cost become prohibitive
Solution Approach 1:
The patent divides the phased-array antenna system into multiple discrete radiating elements that can be independently assembled on separate substrates. Each substrate contains a subset of antenna elements, allowing the overall system to be constructed from modular units rather than requiring a single large monolithic structure. This segmentation enables the system to achieve the required beam-steering capability through coordinated operation of distributed elements while reducing the footprint of any individual assembly.
Solution Approach 2:
The patent transitions from traditional two-dimensional planar arrays to three-dimensional stacked configurations. Multiple layers of radiating elements are assembled vertically on top of each other, utilizing the third dimension to increase the effective number of elements without proportionally increasing the planar area. This vertical stacking allows the system to maintain high gain and beam-steering performance while significantly reducing the horizontal footprint.
2Reliability
If the number of radiating elements is increased to achieve higher gain, then beam quality improves, but the area and assembly cost increase
Solution Approach 1:
The patent implements a nested configuration where multiple radiating elements are stacked vertically in three-dimensional layers. Each layer contains antenna elements that are nested above or below other layers, allowing the system to pack a large number of radiating elements into a compact volume. This nested arrangement increases the effective element count for achieving higher gain while minimizing the planar area and total semiconductor material required compared to traditional two-dimensional expansions.
3Length of moving object
If ultra-thin and small devices are assembled, then device miniaturization is achieved, but conventional vacuum gripper assembly becomes difficult
Solution Approach 1:
The patent combines multiple ultra-thin device layers into a single integrated assembled structure. Rather than attempting to handle and assemble each ultra-thin component separately using conventional vacuum grippers, the invention integrates multiple radiating element layers onto shared substrates, creating thicker but more manufacturable intermediate assemblies. This merging approach maintains the ultra-thin profile of individual components while making the overall assembly process compatible with conventional manufacturing techniques.
Solution Approach 2:
The patent introduces substrates as intermediary carriers that support multiple radiating elements during assembly. These substrates act as mediators between the ultra-thin device components and the final assembled structure, providing mechanical support and handling surfaces that enable conventional assembly equipment to work effectively. The substrates allow vacuum grippers to grasp and manipulate assemblies at a practical scale rather than attempting to handle individual ultra-thin elements directly.
Data Source
AI summary
Phased-array antenna systems can be constructed using transfer printed active components. Phased-array antenna systems benefit from a large number of radiating elements (e.g., more radiating elements can form sharper, narrower beams (higher gain)). As the number of radiating elements increases, the size of the part and the cost of assembly increases. High throughput micro assembly (e.g. by micro-transfer printing) mitigates costs associated with high part-count. Micro assembly is advantaged over monolithic approaches that form multiple radiating elements on a semiconductor wafer because micro assembly uses less semiconductor material to provide the active components that are necessary for the array. The density of active components on the phased-array antenna system is small. Micro assembly provides a way to efficiently use semiconductor material on a phased array, reducing the amount of non-active semiconductor area (e.g., the area on the semiconductor material that does not include transistors, diodes, or other active components).