Capacitor Array With Shortened Lower Capacitor For Compact Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Multilayer capacitors used in power driving systems for vehicles face challenges in achieving high capacitance, thermal reliability, electrical reliability, and mechanical reliability while maintaining a compact size, as their increased length due to metal frames and conductive bonding layers necessitates larger mounting areas and changes to electrode pad designs.
Innovation Solution
A capacitor array is designed with multilayer capacitors stacked perpendicular to each other, where the length of the lower capacitor is shorter than the upper one, and metal frames are used to connect external electrodes, with conductive bonding layers enhancing bonding strength without increasing the mounting area, allowing for high capacitance and improved durability against vibrations and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal frame is used to space the multilayer capacitor from the board to improve durability against vibrations and deformation, then mechanical reliability is improved, but the length of the electronic component increases due to the thickness of the metal frame and conductive bonding layer, resulting in increased mounting area
Solution Approach 1:
The patent extracts the metal frame from the electronic component structure, eliminating it while maintaining durability through an alternative design where the capacitor body is directly mounted on the board without requiring a metal frame for spacing or protection.
Solution Approach 2:
The patent introduces a bonding pad as an intermediary element between the capacitor body and the board, which provides both mechanical support and electrical connection, replacing the need for a metal frame structure.
2Quantity of substance
If multiple multilayer capacitors are stacked to implement high capacitance in a limited space, then capacitance is increased, but the length of the electronic component increases due to the added thickness of metal frames and conductive bonding layers
Solution Approach 1:
The patent merges multiple capacitor bodies into a stacked configuration where they share common bonding pads and mounting structures, eliminating the need for separate metal frames around each capacitor, thus reducing the overall length while maintaining high capacitance.
Solution Approach 2:
The bonding pads serve multiple functions: they provide electrical connections for each capacitor, mechanical support for the stacked structure, and spacing from the board, replacing the need for separate metal frame structures.
3Reliability
If the length of the electronic component is increased to accommodate metal frames and conductive bonding layers, then durability against vibrations is improved, but the mounting area increases and electrode pad design must be changed
Solution Approach 1:
The patent applies localized reinforcement at the bonding pad areas where vibrations are most critical, rather than using a comprehensive metal frame structure, providing targeted durability improvement without increasing overall mounting area.
Solution Approach 2:
Instead of using a metal frame to protect the capacitor from vibrations, the patent inverts the approach by designing the bonding pad structure itself to be vibration-resistant, making the connection interface the protective element rather than an external frame.
Data Source
AI summary
An electronic component and a board having the same mounted thereon are provided. The electronic component includes an electronic component including a capacitor array in which a plurality of multilayer capacitors including a capacitor body and a pair of external electrodes, respectively disposed on both end portions of the capacitor body in a first direction, are stacked in a second direction, perpendicular to the first direction, and a length of a multilayer capacitor, disposed on a lower end in the second direction, in the first direction is less than a length of another multilayer capacitor in the first direction; and a pair of metal frames, respectively disposed to be connected to the pair of external electrodes of the multilayer capacitor disposed on the lower end.