Chip Components Parallel Mounting for High-Density PCB Integration
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Solution Overview
Problem
Conventional electronic devices with metal terminals occupy a large area on circuit boards, making high-density mounting challenging, especially with the downsizing of electronic equipment.
Innovation Solution
The electronic device design features chip components with terminal electrodes connected via a terminal connection body and conductive terminals, where the chip components are arranged with end surfaces facing the mount board, reducing space occupation and allowing for series connection, with a support member and insulation to prevent excessive load and short-circuiting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If chip components are arranged with end surfaces perpendicular to the mount board (conventional arrangement), then the connection structure is simple, but the occupation area on the circuit board is large
Solution Approach 1:
The patent changes the arrangement dimension of chip components from perpendicular to parallel relative to the mount board. By arranging chip components with their end surfaces facing the mount board in a parallel direction, the projection area on the circuit board is reduced, enabling high-density mounting while maintaining electrical connection functionality through conductive terminals extending to the mount board
2Reliability
If multiple chip components are connected in series to increase withstand voltage, then the safety and reliability improve, but the device complexity and space requirement increase
Solution Approach 1:
The patent combines multiple chip components into a single integrated assembly where they are connected in series through conductive terminals. The chip components are arranged adjacently with their end surfaces facing the mount board, and conductive terminals establish electrical connections between them, creating a compact series-connected unit that functions as one integrated component
Solution Approach 2:
The series connection is achieved through a planar arrangement where chip components are positioned side-by-side with end surfaces facing the mount board, rather than stacking them vertically or arranging them in a traditional perpendicular configuration. This dimensional change allows series connection while minimizing the footprint area
3Reliability
If conductive terminals are made longer to improve connection reliability, then the electrical connection is more stable, but the susceptibility to external forces and potential damage increases
Solution Approach 1:
The conductive terminals are arranged to extend in a direction substantially perpendicular to the arrangement direction of chip components. This orthogonal orientation allows the terminals to achieve sufficient connection reliability through proper grounding and electrical contact while minimizing their exposure length in the direction where they would be susceptible to external mechanical forces
Data Source
AI summary
An electronic device includes chip components, a terminal connection body, conductive terminals, and a support member. Each of the chip components has a pair of end surfaces on which terminal electrodes are formed. The terminal connection body connects the terminal electrodes on one side of the chip components arranged next to each other in a parallel direction to the end surfaces. Each of the conductive terminals includes a connection part and a mount part. The connection part is connected with the terminal electrode of either of the chip components located on both ends of the chip components connected in series via the terminal connection body. The mount part faces the connection part and is connected with a mount board. The support member is disposed between the connection parts and the mount parts. The chip components are arranged so that the end surfaces face the mount board.