Modular MLCC Package with Longitudinal Edge Termination

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Solution Overview

Problem

Current electrical component packaging technologies, particularly for multilayered ceramic capacitors (MLCCs), face limitations in capacitance, size variability, and stress resistance due to the need for uniform component sizes and lead attachment interfaces, which restricts their use in miniaturized and harsh environments.

Innovation Solution

A modular electrical component package that allows components of different shapes and sizes to be packaged together using high-temperature conductive interconnect materials, such as transient liquid phase sintering (TLPS), enabling flexible assembly and increased capacitance without the need for uniform component sizes, and allowing components to be attached on opposing sides of a lead frame.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If multiple MLCC components are stacked to increase capacitance, then capacitance density is improved, but all components must be of the same case size which limits design flexibility

Engineering Contradiction:

ImprovecapacitanceVSAvoidcomponent size variation

Core Design Contradiction:

Quantity of substanceVSAdaptability or versatility

Solution Approach 1:

The invention uses a universal lead frame structure with a common first lead and multiple second leads that can accommodate MLCC components of different case sizes. The lead frame serves multiple functions: providing electrical connections, mechanical support, and stress isolation for components of varying dimensions, enabling a single package design to handle diverse component configurations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The invention segments the capacitive function across multiple MLCC components within a single package, allowing each component to be independently selected based on capacitance requirements rather than forcing uniform sizing. This segmentation enables flexible capacitance accumulation while maintaining package integrity through the common lead frame architecture.

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If leads are attached to MLCC terminations in stacked packages, then assembly is simplified, but size and shape variations in MLCC components create manufacturing limitations

Engineering Contradiction:

Improveassembly simplicityVSAvoidcomponent uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The lead frame acts as an intermediary between the MLCC components and the external circuit board. It provides a standardized interface structure that mediates the connection to components of varying sizes and shapes, absorbing the manufacturing variations while maintaining consistent external connections. This intermediary structure eliminates the need for precise matching of component dimensions.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Area of stationary object

If MLCC packages are placed in harsh environments with board flexing, then compact design is achieved, but cracks form due to stress from vibration and temperature

Engineering Contradiction:

Improveboard spaceVSAvoidstress resistance

Core Design Contradiction:

Area of stationary objectVSReliability

Solution Approach 1:

The invention transitions from traditional end-face termination to longitudinal edge termination of MLCC components. This dimensional change in the connection interface allows the leads to wrap around and secure the components along their length, providing superior mechanical support and stress distribution in harsh environments while maintaining compact board footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Quantity of substance

If redundant capacitors are placed individually on the circuit board to meet capacitance requirements, then capacitance is achieved, but circuit board space and assembly time increase

Engineering Contradiction:

ImprovecapacitanceVSAvoidcircuit board space

Core Design Contradiction:

Quantity of substanceVSArea of stationary object

Solution Approach 1:

The invention merges multiple MLCC components into a single integrated package with common leads, combining their capacitance values while occupying the space of essentially one component footprint on the circuit board. This consolidation achieves the required total capacitance without proportionally increasing board space or assembly complexity.

Inventive Principle:

Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution increases capacitance density, reduces assembly complexity, and enhances stress resistance, enabling more flexible and efficient packaging of multiple components in confined spaces with improved performance in harsh environments.

Implementation Method 1

a first lead is connected to the first longitudinal edge by a first interconnect and a second lead is connected to the second longitudinal edge by a second interconnect

Methodology Applied

Scientific EffectTransient liquid phase sintering: Sintering

Data Source

PatentUS9805872B2Multiple MLCC modules

Publication Date: 2017.10.31 KEMET ELECTRONICS CORP

AI summary

An improved module is provided. The module comprises a multiplicity of electronic components wherein each electronic component comprises a first external termination with at least one first longitudinal edge and a second external termination with at least one second longitudinal edge. A first lead is connected to the first longitudinal edge by a first interconnect and a second lead is connected to the second longitudinal edge by a second interconnect.