Composite Ceramic Capacitor Alignment via Solder Surface Tension
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Solution Overview
Problem
Multilayer ceramic capacitors in electronic devices generate acoustic noise due to vibrations, which becomes a concern with the miniaturization and slimming of these devices, and existing solutions fail to effectively reduce noise while ensuring proper alignment and mounting of components.
Innovation Solution
A composite electronic component is designed by coupling a multilayer ceramic capacitor with a ceramic chip using solder, where the ceramic chip is made of hard alumina and the solder forms angles of 45 degrees or less, enhancing surface tension to stabilize the capacitor's alignment and reduce noise by blocking vibration transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a ceramic chip is coupled to the lower surface of a multilayer ceramic capacitor to reduce acoustic noise, then acoustic noise is decreased, but it becomes difficult to ensure correct bonding position and alignment
Solution Approach 1:
A positioning protrusion is provided on the lower surface of the multilayer ceramic capacitor that fits into a corresponding positioning groove on the upper surface of the ceramic chip. This mechanical intermediary structure ensures precise alignment and correct bonding position between the capacitor and chip, solving the alignment difficulty while maintaining the noise reduction function of the ceramic chip coupling
2Object-affected harmful factors
If the multilayer ceramic capacitor is bonded to the ceramic chip, then acoustic noise is reduced by blocking vibration transfer, but the complexity of the bonding process and structure increases
Solution Approach 1:
The positioning protrusion and groove structures are integrated directly into the ceramic chip and capacitor body during manufacturing, merging the alignment function with the structural components themselves. This eliminates the need for separate alignment mechanisms or complex bonding fixtures, reducing overall structural complexity while effectively blocking vibration transfer between the capacitor and substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces acoustic noise and ensures stable alignment of the multilayer ceramic capacitor, preventing distortion and failures in mounting, by utilizing the ceramic chip's hardness and controlled solder angles to absorb and block vibrations.
Implementation Method 1
the solder forms angles of 45 degrees or less, enhancing surface tension to stabilize the capacitor's alignment
Implementation Method 2
utilizing the ceramic chip's hardness and controlled solder angles to absorb and block vibrations
Data Source
AI summary
A composite electronic component includes a composite body including a multilayer ceramic capacitor and a ceramic chip coupled to each other. The multilayer ceramic capacitor includes a first ceramic body and first and second external electrodes, and the ceramic chip is disposed below the multilayer ceramic capacitor and includes a second ceramic body having first and second terminal electrodes. The multilayer ceramic capacitor and the ceramic chip are coupled by solder disposed between the first and second external electrodes and the first and second terminal electrodes, and each angle (θ) defined by inner side surfaces of the solder, respectively disposed on inner ends of bent portions of the first and second terminal electrodes disposed on an upper surface of the second ceramic body, and an upper plane of the second ceramic body of the ceramic chip satisfies 45 degrees or less.