Multilayer Capacitor Vibration Absorption via Extended Metal Frames
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Solution Overview
Problem
Multilayer ceramic capacitors (MLCCs) generate acoustic noise due to piezoelectric vibrations transferred to circuit boards, which are displeasing and more noticeable in modern electronic devices with low noise levels.
Innovation Solution
A multilayer electronic component design featuring a support plate with first and second metal frames extending beyond the thickness of the capacitor, electrically connected to both ends, reducing piezoelectric vibrations by absorbing mechanical stress and vibrations through the metal frames.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the MLCC is mounted directly on the circuit board, then the mounting structure is simple, but piezoelectric vibrations are transferred to the board causing acoustic noise
Solution Approach 1:
A support plate is introduced as an intermediary component between the MLCC and the circuit board. The support plate has a first metal frame that extends beyond the thickness of the MLCC, serving as a mediator to absorb piezoelectric vibrations and prevent them from being transferred to the circuit board, thereby reducing acoustic noise while maintaining a relatively simple mounting structure.
2Object-generated harmful factors
If the metal frames extend beyond the capacitor thickness, then vibration absorption is improved, but the component height increases
Solution Approach 1:
The first metal frame extends in the vertical dimension (beyond the thickness of the MLCC) to provide vibration absorption functionality. This dimensional extension allows the frame to act as a vibration sink without requiring lateral expansion, thus absorbing piezoelectric vibrations effectively while minimizing the increase in overall component footprint.
3Stability of the object's composition
If rigid mounting is used, then mechanical stability is improved, but piezoelectric vibrations are transferred more effectively to the board
Solution Approach 1:
The support plate structure changes the mechanical parameters of the mounting system. By introducing a metal frame that extends beyond the MLCC thickness and is electrically connected to both ends, the system transforms the rigid mounting into a semi-flexible structure that can absorb vibrations through elastic deformation, thereby reducing vibration transfer to the circuit board while maintaining adequate mechanical stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces acoustic noise by minimizing stress and vibration transfer to the circuit board, enhancing the reliability of the multilayer electronic component.
Implementation Method 1
the first and second metal frames extending lengthwise in an amount greater than a thickness of the first multilayer capacitor so that one end of the first and second metal frames constitutes amounting part
Implementation Method 2
since the dielectric layers may have a piezoelectric property, a piezoelectric phenomenon may occur between the internal electrodes when a direct or alternating current voltage is applied to the MLCC, which expands and contracts a volume of a ceramic body according to a frequency and generates periodic vibrations
Data Source
AI summary
A multilayer electronic component includes a first multilayer capacitor electrically connected to a first surface of a support plate formed of an insulating material; and first and second metal frames electrically connected to first and second ends of the support plate, respectively. The first and second metal frames extend in an amount greater than a thickness of the first multilayer capacitor so that a first end of the first and second metal frames constitutes a mounting part.