Multilayer Ceramic Component Asymmetric Design for Mounting Stability

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Solution Overview

Problem

The miniaturization of multilayer ceramic electronic components, which increases the number of stacked layers for high capacitance, often results in components toppling over when mounted on a board, leading to defects and reliability issues.

Innovation Solution

A multilayer ceramic electronic component with a hexahedral ceramic body, where the thickness is greater than the width, featuring internal electrodes alternately exposed through end surfaces and external electrodes connected to these internal electrodes, with head and band parts on the end and main surfaces but not on the side surfaces, and insulation layers on the side surfaces to prevent short-circuits.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Quantity of substance

If the number of stacked layers is increased to achieve high capacitance, then the capacitance is improved, but the component becomes top-heavy and topples over during mounting

Engineering Contradiction:
ImprovecapacitanceVSAvoidmounting stability
Core Design Contradiction:
Quantity of substanceVSReliability

Solution Approach 1:

The patent applies asymmetry by making the thickness T greater than the width W (T/W > 1.0), creating an asymmetric hexahedral shape. This asymmetric design shifts the center of gravity downward and provides a stable base during mounting, preventing the component from toppling over while maintaining high capacitance through increased layer stacking in the thickness direction.

Inventive Principle:
Principle #4Asymmetry

2Volume of moving object

If the component is miniaturized and layered thickness is reduced, then the size is decreased, but the component becomes unstable and prone to toppling

Engineering Contradiction:
Improvecomponent sizeVSAvoidmounting stability
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent resolves the stability issue by utilizing the thickness dimension more effectively. By increasing the thickness T relative to width W while maintaining a compact footprint, the design creates a tall, stable structure similar to a skyscraper. This dimensional approach allows miniaturization in the planar directions while maintaining stability through increased vertical dimension.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If external electrodes are formed on all surfaces for electrical connection, then the electrical connectivity is improved, but short-circuits occur when the component topples over

Engineering Contradiction:
Improveelectrical connectivityVSAvoidshort-circuit risk
Core Design Contradiction:
Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies local quality by selectively forming external electrodes only on specific surfaces (end surfaces and main surfaces) while deliberately excluding the side surfaces. This localized electrode arrangement ensures that even if the component topples, the electrodes on the stable base (side surfaces) remain uncovered, preventing short-circuits while maintaining adequate electrical connectivity through the exposed electrodes on other surfaces.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS9049798B2Multilayered ceramic electronic component and board for mounting the same
Publication Date: 2015.06.02 SAMSUNG ELECTRO MECHANICS CO LTD
  • US9049798B2 patent drawing
  • US9049798B2 patent drawing
  • US9049798B2 patent drawing

AI summary

There is provided a multilayered ceramic electronic component including a ceramic body having a hexahedral shape, including a dielectric layer, satisfying T/W>1.0 when a length thereof is L, a width thereof is W, and a thickness thereof is T, and having first and second main surfaces, first and second end surfaces, and first and second side surfaces, a plurality of first and second internal electrodes, and first and second external electrodes electrically connected to the first and second internal electrodes, wherein the first and second external electrodes are electrically connected to the exposed portions of the first and second internal electrodes, include first and second head parts formed on the first and second end surfaces, and first and second band parts formed on the first and second main surfaces, and are not formed on the first and second side surfaces.