Capacitor Element Orientation for Vibration Cancellation
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Solution Overview
Problem
High-permittivity ceramic capacitors in electronic equipment cause mechanical distortion and vibration when subjected to voltage, leading to acoustic noise and potential malfunction of sensors mounted on the same circuit board, especially when encapsulated with a mold resin layer, as existing vibration suppression techniques are not effective for such configurations.
Innovation Solution
A capacitor element-mounted structure with multiple capacitor elements, including a first, second, and third capacitor element, each with a rectangular multilayer structure, are electrically connected in series or parallel on a wiring board and encapsulated with a mold resin layer, where the stacking direction of each capacitor element is oriented to minimize vibration transmission through strategic opposition of end and side surfaces with the resin layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If high-permittivity ceramic materials are used to increase capacitance, then the capacitance value is improved, but mechanical distortion and vibration occur causing acoustic noise
Solution Approach 1:
The patent applies asymmetry by arranging capacitor elements with different orientations (some with stacking directions perpendicular to the board, others parallel) rather than uniform symmetry. This asymmetric arrangement creates different vibration modes that cancel each other out, reducing acoustic noise while maintaining high capacitance values using high-permittivity ceramic materials
Solution Approach 2:
The patent uses the counterweight principle by positioning capacitor elements to generate opposing vibration forces. Capacitors arranged in specific patterns create vibration waves that are equal in magnitude but opposite in phase, causing destructive interference that cancels out the acoustic noise generated by individual capacitors
2Reliability
If capacitor elements are encapsulated with a mold resin layer, then protection and integration are improved, but vibration transmission to the wiring board increases
Solution Approach 1:
The patent applies local quality by allowing different regions of the wiring board to have different capacitor arrangements. Some areas have capacitors with stacking directions perpendicular to the board (reducing vibration transmission through the resin), while other areas have parallel arrangements, creating localized vibration cancellation zones that maintain overall system reliability
Solution Approach 2:
The patent transitions from a single-dimensional arrangement (all capacitors parallel to the board) to a multi-dimensional arrangement where capacitors can be oriented both perpendicular and parallel to the board. This dimensional change allows vibration cancellation in multiple directions, reducing overall vibration transmission while maintaining encapsulation protection
3Quantity of substance
If multiple capacitor elements are mounted on the wiring board, then the total capacitance is improved, but the vibration and noise generation increase
Solution Approach 1:
The patent merges multiple capacitor elements into a coordinated system where their individual vibration effects are combined through destructive interference. By strategically arranging capacitors in patterns that create opposing vibration modes, the system achieves high total capacitance while the combined vibration output is minimized through wave cancellation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces or prevents vibration-induced noise and malfunction by effectively canceling out vibration modes in both the X-axis and Y-axis directions, enhancing the reliability of electronic equipment.
Implementation Method 1
Since these high-permittivity ceramic materials have piezoelectric characteristics and electrostriction, a monolithic ceramic capacitor including a dielectric made of a high-permittivity ceramic material is mechanically distorted when a voltage is applied
Implementation Method 2
Since these high-permittivity ceramic materials have piezoelectric characteristics and electrostriction, a monolithic ceramic capacitor including a dielectric made of a high-permittivity ceramic material is mechanically distorted when a voltage is applied
Implementation Method 3
When the main surface of the wiring board populated with monolithic ceramic capacitors is entirely covered with a mold resin layer, vibration occurs not only in the wiring board but also in the circuit board including the mold resin layer as a whole
Data Source
AI summary
A circuit module includes a first and second monolithic ceramic capacitors encapsulated by a mold resin layer on a wiring board. The first and second monolithic ceramic capacitors are lined up along a direction parallel or substantially parallel to the main surface of the wiring board and are electrically connected in series or in parallel through a conductive pattern provided on the wiring board. One of a pair of end surfaces of the first monolithic ceramic capacitor is opposed to one of the width-direction side surfaces as a pair of side surfaces of the second monolithic ceramic capacitor with the mold resin layer interposed.