Capacitor Array With Plated Metal Frames
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Solution Overview
Problem
Existing capacitors used in electric components, such as those in vehicles, require separate cooling devices due to low thermal stability, increasing costs and complexity when trying to achieve high capacitance and reliability.
Innovation Solution
A capacitor array is created with a structure of multiple capacitors arranged in a column or row, using metal frames with penetration portions connected to external electrodes and filled with a plating member, allowing for reliable bonding without high-temperature solder, and a manufacturing method involving the preparation and plating of these components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high-temperature solder or binder is used to bond multilayer capacitors, then bonding strength is improved, but manufacturing complexity and process steps increase
Solution Approach 1:
The invention extracts and eliminates the binder material from the bonding process. Instead of using solder or binder, the patent directly bonds the metal frame to the external electrodes through plating, removing the intermediate binding layer and simplifying the manufacturing process while maintaining bonding strength
Solution Approach 2:
The plating layer acts as an intermediary between the metal frame and external electrodes. The plating member is formed on the metal frame through electroplating, creating a metallurgical bond that eliminates the need for separate binder application and thermal processing steps
2Reliability
If multiple binding processes are used to bond several tens to hundreds of capacitors, then bonding reliability is improved, but manufacturing time and productivity are worsened
Solution Approach 1:
The invention merges multiple binding operations into a single plating process. By forming a plating layer on the metal frame that contacts all external electrodes simultaneously, the patent achieves reliable bonding of multiple capacitors in one step, dramatically improving manufacturing efficiency
Solution Approach 2:
The metal frame is prepared with plating in advance before assembly. The plating member is formed on the metal frame prior to bonding, ensuring that when capacitors are stacked and bonded, the bonding interface is already optimized for reliable electrical and mechanical connection
3Quantity of substance
If electrolytic condensers or film condensers are used to achieve high capacitance, then capacitance requirement is met, but thermal stability deteriorates requiring separate cooling devices
Solution Approach 1:
The invention uses a composite structure combining multiple ceramic capacitor units with a metal frame and plating layer. This composite arrangement achieves high total capacitance through parallel connection of multiple stable ceramic capacitors while maintaining the thermal stability of ceramic materials, eliminating the need for cooling devices required by electrolytic or film capacitors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable bonding of multiple capacitors in a simple manner, preventing deformation or damage from thermal or mechanical causes, achieving high capacitance without the need for a separate cooling device and improving efficiency with increased numbers of capacitors.
Implementation Method 1
a plating member filling the penetration portions
Data Source
AI summary
An electronic component is provided to include: a capacitor array having a structure in which a plurality of capacitors are arranged; a pair of metal frames disposed on side surfaces of the capacitor array, connected to external electrodes of the plurality of capacitors, and including penetration portions formed in positions in which the pair of metal frames are connected to the external electrodes; and a plating member filling the penetration portions. A manufacturing method thereof is further provided.