Multiple Fixed Capacitors TRIZ Cases
- Capacitor Assemblies With Fusing Wire Bonds for High-Power Modules
A capacitor assembly uses a wire bond to break connection when current reaches a fusing threshold, isolating faults within the module.
- Insulating Case Protrusions for Chip Assembly and Thermal Management
Protrusion portions on an insulating case position chip components against a plate portion, reducing assembly time while preventing joint interference.
- Power Capacitor with Integrated Dielectric Interference Suppression
Dielectric layers between energizing units and housing walls create planar capacitors that suppress electromagnetic interference without separate components.
- Capacitor Structure Thickness Control for BEOL Stability
Monitoring second layer thickness adjusts first layer targets to stabilize total capacitance against back end of line process variations.
- Interdigitated DC Link Bus for Power Converter Inductance Reduction
Interdigitated planar conductive layers reduce inductance between positive and negative bus bars, enabling switching speeds exceeding 200 KHZ.
- Energy Storage Holder Support Portion Resonance Frequency
Support portions in the holder maintain resonance frequency despite increased device count.
- RJ-45 Connector Substrate Segmentation for Crosstalk Reduction
Segmented plated through-holes on the connector substrate reduce crosstalk and insertion loss for Category 8 compliance.
- Interconnectable Electronic Device Cases with Engagement Portions
Connecting portions on electronic device cases engage to interlock multiple units, resolving the bottleneck of handling individual components as a single unit.
- Capacitor Bus Bar Thermal Shielding for Power Conversion Downsizing
An intervening bus bar segment blocks heat transfer from power components, suppressing capacitor temperature rise without adding parts.
- Configurable Multi-Capacitor Assembly with Tiered Jumper Connections
Tiered wound capacitor elements connect via jumpers to configure capacitance, resolving volumetric efficiency constraints while maintaining safety compliance.
- Laminated Electronic Component Vertical Capacitor Stacking
Vertical capacitor stacking forms a perpendicular current loop, reducing equivalent series inductance and volume increase.
- Capacitor Heat Dissipation via Elastic Plate Springs
Plate springs apply elastic force to hold the capacitor unit against a cooling plate, preventing filler resin from blocking heat dissipation.
- Lanthanum-Doped Barium Titanate Capacitor for Safe Energy Storage
A lanthanum-doped barium titanate ceramic capacitor stores electrical energy using a humidity-controlled electrolyte to boost electron mobility.
- Multilayer Ceramic Capacitor CR Product Optimization
Segmented multilayer ceramic capacitor design balances high capacitance and insulation resistance through structured unit capacitor distribution.
- Ceramic Electronic Component Terminal Attachment Without Solder
Mechanical fitting arms engage wraparound portions to eliminate high-temperature solder, reducing environmental burden and production costs.