Insulating Case Protrusions for Chip Assembly and Thermal Management
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Solution Overview
Problem
Conventional electronic devices with integrated chip components require time and effort to position and assemble, as each component must be individually placed within a case, leading to inefficiencies in the mounting process.
Innovation Solution
An electronic device design featuring a plurality of chip components arranged with an insulating case that includes protrusion portions, allowing for efficient positioning and assembly by contact with the case's plate portion and adjacent components, while preventing interference with joint formation and enhancing heat dissipation through higher thermal conductivity than air.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If chip components are positioned and assembled one by one into a case, then each component can be securely placed, but it takes time and effort to position and assemble the components
Solution Approach 1:
The case is designed with protrusion portions that extend into the mounting board's through holes before the chip components are placed. This preliminary positioning structure allows the case to be pre-positioned on the board, enabling subsequent rapid placement of multiple chip components without individual positioning steps, thus reducing assembly time while maintaining secure placement
2Manufacturing precision
If the case has high protrusion portions to secure chip components, then positioning is improved, but the case may hinder the joint between chip components and mounting board
Solution Approach 1:
The case design features protrusion portions with localized height variations - higher protrusions in areas where positioning is needed and lower or recessed areas where chip components make contact with the mounting board. This local differentiation allows the case to provide precise positioning through taller protrusions while ensuring that shorter regions do not interfere with the solder joints between chip components and the board, thus maintaining both positioning precision and joint reliability
3Area of stationary object
If chip components are mounted densely without a case, then space is utilized efficiently, but heat dissipation characteristics deteriorate
Solution Approach 1:
The case acts as an intermediary thermal management structure between the densely mounted chip components and the mounting board. It incorporates thermal conduction paths and heat dissipation structures that facilitate heat transfer from the chip components through the case to the board, enabling efficient heat dissipation while maintaining dense component layout and space utilization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables rapid and efficient assembly of chip components, prevents joint interference, and improves heat dissipation by utilizing protrusion portions with lower heights than the components, ensuring effective thermal management and reduced assembly time.
Implementation Method 1
The insulating case has a thermal conductivity higher than that of the air. Thus, compared to chip components mounted simply densely, the electronic device has excellent heat dissipation characteristics.
Data Source
AI summary
An electronic device includes a plurality of chip components and an insulating case. The chip components are arranged in a first direction. The case includes a plate portion, a first protrusion portion, and a second protrusion portion. The plate portion faces first side surfaces of the chip components. The first protrusion portion is formed along a plate-portion first side of the plate portion and protrudes from the plate portion toward a downside perpendicular to the first direction. The second protrusion portion is formed to the first protrusion portion in a second direction and protrudes from the plate portion toward the downside. A protrusion length of the first protrusion portion and the second protrusion portion from the plate portion toward the downside is smaller than a protrusion length of the chip component included in the chip components from the plate portion toward the downside.