Ceramic Electronic Component Terminal Attachment Without Solder
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Solution Overview
Problem
Conventional ceramic electronic components with metal terminals require high-temperature solder for bonding, leading to environmental concerns and increased production time and cost, while also being prone to connection breakdown due to differences in linear expansion coefficients.
Innovation Solution
A ceramic electronic component design featuring metal terminal portions with fitting arm portions and engagement projections that securely hold terminal electrodes without the need for solder, providing resilience against temperature changes and allowing for easier production and reduced material usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If high-temperature solder is used for bonding metal terminals to chip component, then bonding strength is improved, but environmental burden increases and production cost increases
Solution Approach 1:
The invention extracts and eliminates the solder material from the bonding process. Instead of using solder to bond metal terminals to the chip component, the patent uses a direct mechanical attachment structure where the metal terminal is fixed to the terminal electrode through a holder structure, completely removing the need for solder and its associated environmental burden.
Solution Approach 2:
The invention replaces the thermal bonding process (soldering) with a mechanical attachment system. The metal terminal is mechanically fixed to the terminal electrode through a holder structure that provides both mechanical support and electrical connection, substituting the thermal-chemical bonding process with a purely mechanical system.
2Reliability
If solder bonding step is used to attach metal terminals to chip component, then electrical connection is ensured, but production time increases
Solution Approach 1:
The holder structure is pre-formed with the metal terminal attached, and the terminal electrode is pre-prepared on the chip component. These components are then assembled together in a single step without requiring separate soldering operations, eliminating the time-consuming solder bonding process while ensuring reliable electrical connection through the pre-designed contact structure.
3Ease of manufacture
If solder is used for bonding metal terminals to chip component, then attachment is achieved, but bonding may break during mounting due to linear expansion coefficient differences
Solution Approach 1:
The invention extracts the solder material from the bonding system and replaces it with a mechanical holder structure. This eliminates the problem of differential thermal expansion between solder and metal terminals, as the holder structure is designed to accommodate thermal stresses without compromising the bonding durability during mounting processes.
Data Source
AI summary
A ceramic electronic component comprising; including a chip component of approximately rectangular parallelepiped, a first metal terminal portion having a first flat plate portion facing a first end face, at least a pair of first fitting arm portions connected to the first flat plate portion, having a first engagement projection engaging with a first wraparound portion holding the first wraparound portion in between, and a first mounting portion connected to the first flat plate portion and extending approximately parallel to one side face, and a second metal terminal portion having a second flat plate portion facing the second end face, at least a pair of second fitting arm portions connected to the second flat plate portion, having a second engagement projection engaging with a second wraparound portion, holding the second wraparound portion in between, and a second mounting portion extending approximately parallel to one side face.