Capacitor Asymmetric Electrode Design for Breakdown Voltage

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Solution Overview

Problem

In integrated circuits, capacitors with single-crystal silicon or polysilicon electrodes face instability due to depletion regions, leading to unreliable capacitance and breakdown voltage, particularly as semiconductor devices shrink in size, necessitating improved reliability and longer dielectric breakdown.

Innovation Solution

A capacitor design featuring a first electrode with a dielectric covering its sidewall and top surface, a second electrode with a larger orthographic projection area on the dielectric layer, and strategically placed vias to prevent dielectric damage from patterning processes, ensuring increased reliability by avoiding direct exposure to denser electric lines.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If single-crystal silicon or polysilicon electrodes are used in capacitors, then the capacitor can be fabricated with conventional processes, but the operating voltage becomes unstable and capacitance cannot be maintained due to depletion region formation

Engineering Contradiction:
Improvefabrication process compatibilityVSAvoidcapacitance stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The patent changes the material parameter of the electrodes from single-crystal silicon or polysilicon to metal materials (such as aluminum, copper, or their alloys). This parameter change eliminates the depletion region formation issue while maintaining fabrication compatibility through established metal deposition processes like sputtering or electroplating.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If MIM capacitor size is reduced to meet scaling requirements, then device integration increases, but breakdown voltage decreases and TDDB reliability deteriorates

Engineering Contradiction:
Improvedevice integration densityVSAvoidbreakdown voltage and TDDB
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent employs a composite dielectric structure consisting of multiple layers with different dielectric materials (such as silicon oxide, silicon nitride, or high-k materials like hafnium oxide). This composite structure increases the effective breakdown voltage and TDDB reliability while allowing smaller physical dimensions for the same capacitance value.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies different dielectric materials with optimized properties to different regions of the capacitor structure. High-k materials are used in specific layers to enhance capacitance density, while other materials provide mechanical strength or process compatibility, achieving localized optimization for both scaling and reliability.

Inventive Principle:
Principle #3Local quality

3Reliability

If the second electrode orthographic projection area is increased to improve reliability, then breakdown voltage increases, but the capacitor occupies more area on the dielectric layer

Engineering Contradiction:
Improvebreakdown voltageVSAvoidcapacitor footprint
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent implements an asymmetric electrode configuration where the second electrode has a larger orthographic projection area than the first electrode. This local asymmetry is strategically applied only to the second electrode, allowing it to provide enhanced breakdown voltage protection without requiring both electrodes to be enlarged, thus minimizing the overall capacitor footprint.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS10600568B2Capacitor and method of fabricating the same
Publication Date: 2020.03.24 UNITED MICROELECTRONICS CORP
  • US10600568B2 patent drawing
  • US10600568B2 patent drawing
  • US10600568B2 patent drawing

AI summary

A capacitor includes a first electrode, a dielectric, and a second electrode. The first electrode is located on a dielectric layer. The dielectric covers the sidewall and the top surface of the first electrode. The second electrode covers the dielectric and the dielectric layer, wherein the orthographic projection area of the second electrode on the dielectric layer is greater than the orthographic projection area of the first electrode on the dielectric layer. The capacitor of the invention has good reliability.