Solid Electrolytic Capacitor Blocking Layer for Silver Migration

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Solution Overview

Problem

Solid electrolytic capacitors face reliability issues due to delamination caused by thermomechanical stresses and silver migration, leading to increased ESR and leakage current, particularly during surface mount technology (SMT) processes and exposure to humidity.

Innovation Solution

Incorporating a blocking layer, preferably a hydrophobic or carbon-based layer, between the cathode and the metal plated layer, along with a nickel plated metal layer, to inhibit metal ion migration and maintain low ESR, which reduces ESR shift and improves humidity resistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If a metal filled layer is used to conduct current from the lead frame to the cathode, then high conductivity is achieved, but silver migration occurs leading to increased leakage current and reliability issues

Engineering Contradiction:
ImproveconductivityVSAvoidsilver migration resistance
Core Design Contradiction:
Use of energy by moving objectVSReliability

Solution Approach 1:

A blocking layer is introduced as an intermediary between the metal filled layer and the cathode. This blocking layer prevents direct contact between silver and the cathode, thereby stopping silver migration while still allowing electrical conduction to occur through the layered structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The capacitor employs a composite structure combining multiple materials: the metal filled layer (silver in polymer/resin matrix) for conductivity, and the blocking layer (hydrophobic or carbon-based) for migration prevention. This composite approach allows simultaneous achievement of high conductivity and silver migration resistance.

Inventive Principle:
Principle #40Composite materials

2Ease of manufacture

If the resin in the metal filled layer is degraded to allow solder wetting, then solderability is improved, but excessive degradation causes silver leeching resulting in poor connection

Engineering Contradiction:
ImprovesolderabilityVSAvoidconnection integrity
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The blocking layer serves as a protective intermediary that prevents silver from leaching out during the soldering process. This allows the resin to be adequately degraded for solder wetting without causing silver loss, as the blocking layer intercepts and contains the silver.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent controls the thermal stability parameters of the resin and the properties of the blocking layer to achieve optimal balance. By adjusting these parameters, the resin degrades sufficiently for solder wetting while the blocking layer prevents excessive silver leeching, maintaining connection integrity.

Inventive Principle:
Principle #35Parameter changes

3Ease of manufacture

If electroplating is performed on water based graphite coatings and silver paint coatings, then metal layer formation is achieved, but diffusion of plating electrolyte through the hydrophilic and porous conductive layer causes high leakage current and electrical shorts

Engineering Contradiction:
Improvemetal layer formationVSAvoidleakage current resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The blocking layer acts as a mediator between the porous conductive layer and the plated metal layer. It prevents plating electrolyte from diffusing through the hydrophilic and porous conductive layer to the anode, thereby eliminating leakage current and electrical shorts while still allowing metal layer formation.

Inventive Principle:
Principle #24Intermediary (Mediator)

4Productivity

If thermomechanical stresses occur during assembly and board mounting, then capacitor assembly is completed, but delamination of layers occurs causing reliability issues

Engineering Contradiction:
Improveassembly completionVSAvoidlayer adhesion
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent uses composite material structures with carefully selected material combinations and interfaces. The blocking layer is specifically designed to be compatible with both the metal filled layer and the plated metal layer, creating strong interfacial bonds that resist delamination under thermomechanical stresses during assembly and board mounting.

Inventive Principle:
Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces ESR shift and leakage current, enhancing the reliability and environmental resistance of solid electrolytic capacitors by preventing metal ion migration and maintaining low electrical resistance.

Implementation Method 1

Incorporating a blocking layer, preferably a hydrophobic or carbon-based layer, between the cathode and the metal plated layer

Methodology Applied
Scientific EffectHydrophobic effect: Hydrophobe

Implementation Method 2

to inhibit metal ion migration and maintain low ESR

Methodology Applied
Scientific EffectDiffusion barrier: Diffusion Barrier

Implementation Method 3

a nickel plated metal layer, to inhibit metal ion migration and maintain low ESR

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 4

An important feature of the solid cathode electrolyte is that it can be made more resistive by exposure to high temperatures. This feature allows the capacitor to heal leakage sites by Joule heating.

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS8896985B2Solid electrolytic capacitors with improved reliability
Publication Date: 2014.11.25 KEMET ELECTRONICS CORP
  • US8896985B2 patent drawing
  • US8896985B2 patent drawing
  • US8896985B2 patent drawing

AI summary

A capacitor with an anode, a dielectric on the anode and a cathode on the dielectric. A blocking layer is on the cathode. A metal filled layer is on said blocking layer and a plated layer is on the metal filled layer.