A hydrophobic blocking layer inhibits silver migration between the cathode and metal plated layer, reducing ESR shift and leakage current during SMT processes.
Mixing flaked and granular tantalum powders achieves high specific capacitance while maintaining pressure resistance.
Work function modifiers lower polymer interface barriers to reduce prolonged charging times in solid electrolytic capacitors.
A solid electrolytic capacitor uses a low-melting-point alloy layer to connect the anode wire and lead frame without high-temperature damage.
A low molecular weight organic semiconductor layer improves dielectric coverage and reduces equivalent series resistance in electrolytic capacitors.
Composite electrode with nitrogen-containing polymer dielectric layer fills cracks in metal oxide to reduce leakage current and improve yield.
Micropatterned anode surfaces create interlocking protrusions that anchor conductive polymer cathodes, preventing delamination in high-density capacitors.
Segmented metal frames with wire bonding reduce the anode lead region, avoiding heat-induced crystallization of the dielectric layer.
A solid electrolytic capacitor uses cold spray metal particle collision to form a metallurgical contact layer on the anode terminal.
A capacitor element uses a surrounding barrier layer and conductive paste to enhance electrical properties.
Bimodal conductive polymer dispersion with 1-10 micron and 1-600 nm particles stabilizes ESR and reduces leakage current in humid environments.
A capacitor dielectric layer features a porous aluminum oxide structure formed by two-stage anodizing to enhance electrostatic capacity.