Solid Electrolytic Capacitor Low-Melting Alloy Terminal Connection
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Solution Overview
Problem
Conventional solid electrolytic capacitors face issues with heat damage during manufacturing, leading to increased costs and reduced capacitance due to high-temperature welding and large lead frame sizes, which affect product quality and size constraints.
Innovation Solution
A solid electrolytic capacitor design featuring a capacitor element with an anode wire inserted and a cathode extraction layer, conductive bumps, and a support frame, along with a simplified manufacturing process that includes electroless plating and inkjet methods for terminal formation, to reduce size and enhance capacitance while minimizing heat exposure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the anode wire and anode lead frame are directly welded using conventional high-temperature welding, then the electrical connection is achieved, but the capacitor element is damaged by heat and the dielectric is destroyed
Solution Approach 1:
The patent introduces a low-melting-point alloy layer as an intermediary between the anode wire and anode lead frame. This alloy layer has a melting point lower than conventional welding materials, allowing connection at reduced temperatures that do not damage the capacitor element or dielectric. The intermediary layer achieves reliable electrical connection while minimizing thermal harm to sensitive components.
Solution Approach 2:
The patent changes the temperature parameter of the welding process by using a low-melting-point alloy with a melting point of 100-200°C, significantly lower than conventional welding temperatures. This parameter change allows the welding process to proceed at temperatures that preserve the integrity of the capacitor element and dielectric while still achieving reliable electrical connection.
2Strength
If large lead frames are used to ensure adequate contact area and structural support, then the mechanical strength and electrical connection are improved, but the capacitor element size is reduced and the overall capacitor size increases
Solution Approach 1:
The patent changes the material parameter of the lead frames by using a high-strength alloy with exceptional strength-to-weight ratio. This allows the lead frames to be made thinner and smaller while maintaining adequate mechanical strength and electrical connection, thereby preserving more space for the capacitor element and reducing overall capacitor size.
Solution Approach 2:
The patent employs composite material structures for the lead frames, combining materials with high strength and good electrical conductivity. This composite approach allows reduced lead frame dimensions while maintaining both mechanical support and electrical connection functions, maximizing the space available for the capacitor element.
3Reliability
If conventional welding materials and processes are used, then the electrical connection is achieved, but the manufacturing cost increases and the process complexity increases
Solution Approach 1:
The patent changes the melting point parameter of the welding material to 100-200°C, which enables the use of simpler, lower-cost welding processes. This parameter change reduces manufacturing complexity and cost while maintaining reliable electrical connection, as the low-temperature process requires less specialized equipment and processing control.
Solution Approach 2:
The patent uses a low-melting-point alloy that can be applied as a thin, inexpensive layer. This material, while having specialized low-melting-point properties, is used in small quantities and can be replaced or reapplied if needed, reducing overall manufacturing cost compared to expensive conventional welding materials and processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the manufacturing process, reduces the size of the capacitor, maximizes capacitance, and achieves a low Equivalent Series Resistance (ESR) characteristic, thereby lowering production costs and improving product quality.
Implementation Method 1
electroless plating and inkjet methods for terminal formation
Data Source
AI summary
Provided is a solid electrolytic capacitor including a capacitor element with a positive polarity; an anode wire of which one end is inserted into the capacitor element and the other end projects outward from the capacitor element; a cathode extraction layer formed on the capacitor element; a plurality of conductive bumps formed on the cathode extraction layer; a molding portion formed to surround the capacitor element and exposing the projecting end of the anode wire and ends of the conductive bumps; an anode lead terminal provided on the molding portion so as to be electrically connected to the exposed end of the anode wire; and a cathode lead terminal provided on the molding portion so as to be electrically connected to the exposed ends of the conductive bumps.