Film Capacitor Busbar Ridge-Receiving Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing film capacitors face challenges in ensuring the reliability of connections between metallikon electrodes and busbars due to irregularities on the outer surfaces, such as ridges and protrusions, which can lead to interference and instability in the joint, affecting the overall performance and reliability of the capacitor.
Innovation Solution
The film capacitor design incorporates a ridge-receiving portion on the busbars to accommodate the ridges on the metallikon electrodes, along with a joining metal and ultrasonic vibration welding to form a stable joint, ensuring reliable connection and reducing interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the metalized film is wound to form the film winding portion, then the capacitor structure is formed, but ridges are formed on the outer surface of the metallikon electrodes due to film displacement, lowering connection reliability
Solution Approach 1:
The patent applies preliminary action by forming the ridge-receiving portion on the busbar surface before the joining process. This pre-formed recessive portion is specifically designed to accommodate the ridge that will form on the metallikon electrode during winding, thereby preventing interference and ensuring reliable connection despite the inevitable ridge formation.
2Reliability
If plate-shaped busbars are arranged on the metallikon electrodes, then electrical connection is established, but interference occurs between busbars and ridges, reducing joint stability
Solution Approach 1:
The patent applies local quality by modifying only the specific region of the busbar where the ridge contacts, rather than changing the entire busbar structure. The ridge-receiving portion is a localized recessive area that precisely accommodates the ridge, while the rest of the busbar maintains its plate-shaped configuration for electrical connection.
3Area of stationary object
If the busbar is designed to cover the entire metallikon electrode surface, then electrical contact area is maximized, but interference with ridges prevents stable arrangement
Solution Approach 1:
The patent converts the harmful ridge formation into a beneficial feature by designing the ridge-receiving portion to accommodate it. The ridge, which would normally cause interference, is now intentionally received in the recessive portion, and the busbar is designed to extend beyond the ridge to maintain maximum electrical contact area while ensuring stable arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for stable arrangement and reliable joining of busbars to metallikon electrodes, enhancing the reliability of the joint and reducing inductance while effectively dissipating heat, thus improving the overall performance of the film capacitor.
Implementation Method 1
ultrasonic vibration is applied to cause the metallikon electrode and the busbar to vibrate relative to each other, thereby melting the joining metal to form a joint between the metallikon electrode and the busbar
Data Source
AI summary
A film capacitor includes: a film winding portion formed by winding at least one metalized film that includes a dielectric film and a metal film provided on a surface of the dielectric film; a pair of metallikon electrodes formed respectively on end faces of the film winding portion in a winding axis direction of the film winding portion; and a pair of busbars each of which is joined to a corresponding one of the metallikon electrodes via a joining metal. Each of the busbars is plate-shaped to cover an outer surface of the corresponding metallikon electrode. At least one of the metallikon electrodes has a ridge that is formed on the outer surface of the metallikon electrode to be convex in the winding axis direction toward the corresponding busbar. In the corresponding busbar, there is formed a ridge-receiving portion in which the ridge of the metallikon electrode is received.