Fixed Capacitor Electrodes TRIZ Cases

A sintered dielectric capacitor employs a non-straight wall structure to prevent cracking under thermal stress while maintaining high capacitance.

Nickel-tin plating on connecting electrodes secures ground electrode smoothness, enabling embedding in substrates with limited space.

External electrodes cover end surfaces of multilayer ceramic electronic components to enhance mounting reliability.

Thick film portions on internal electrode exposures enable plating-based external electrodes for laminated ceramic components.

A laminated capacitor wiring structure introduces a supplemental via between power and ground vias to decrease parasitic inductance at high frequencies.

Multi-layer solder structure bonds copper electrodes to metal frames, preventing separation under thermal and mechanical stress.

Z-directed capacitors insert into drilled holes via conductive side channels to boost component density without slowing manufacturing.

Alkyl methacrylate polymer coating on multilayer ceramic electronic components suppresses ion migration and short circuit defects caused by moisture.

Segmented outer electrodes with lateral resin coverage lower ESR and improve crack resistance in multilayer ceramic capacitors.

A multilayer capacitor uses pin hole conducting portions to connect external conductor layers for parallel current flow.

Laser cutting forms flat external electrode ends on multilayer ceramic components, reducing gap deviations between band portions during via drilling.

A multilayer ceramic component uses a magnesium segregation phase to suppress grain growth in thin dielectric layers.

Segmented electrode formation with sputtered side faces reduces thickness without compromising plating resistance.

Direct terminal connections eliminate bus bars in the capacitor module, suppressing equivalent series inductance for efficient switching surge absorption.

Alternating stripe-type inner electrode patterns on ceramic green sheets to maximize overlapping area and capacitance density.

Curved corner geometry in multilayer capacitors prevents warpage from electrode thickness differences while securing moisture resistance reliability.

Copper internal electrodes and exterior voids restore insulation after short-circuits, preventing overheating.

Side-exposed copper electrodes lower inductance and reflect laser light during via formation, preventing electrode damage.

A multilayer ceramic capacitor uses a radial particle size gradient to boost capacitance density.