Z-Directed Capacitors for High-Density PCBs
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Solution Overview
Problem
Current printed circuit board (PCB) manufacturing faces challenges in achieving high component densities and frequencies of operation due to the complexity of embedding resistive elements between layers, which is time-consuming and difficult to modify.
Innovation Solution
The introduction of Z-directed components that can be inserted into a printed circuit board after assembly, featuring a body with conductive channels and annular plates arranged in an alternating pattern, allowing for efficient signal transmission and higher frequency operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If resistive elements are embedded between layers of PCB during manufacturing, then component density can be increased, but the manufacturing process becomes more time-consuming and difficult to modify
Solution Approach 1:
The invention divides the resistive element into a separate modular component that can be independently manufactured and then inserted into the PCB. This segmentation allows the PCB manufacturing process to remain simple and efficient while the resistive element can be produced separately using optimized processes, thereby increasing component density without reducing manufacturing productivity.
Solution Approach 2:
The invention transitions from planar surface-mount components to three-dimensional through-hole insertion components. The resistive element is inserted vertically through the PCB thickness (Z-direction), utilizing the third dimension for component placement. This enables higher component density by stacking components through the board thickness rather than only placing them on the surface.
2Quantity of substance
If resistive elements are embedded between layers of PCB during manufacturing, then component density can be increased, but changes become difficult to implement
Solution Approach 1:
By segmenting the resistive element as a separate insertable component rather than embedding it during PCB lamination, the design allows for easy modification. Different resistive elements can be inserted or removed after PCB assembly, enabling design changes and iterations without requiring complete PCB remanufacturing.
Solution Approach 2:
The invention introduces dynamic reconfigurability to the PCB assembly process. The resistive elements can be inserted, removed, or replaced after the PCB is assembled, allowing the system to adapt to different configurations and requirements. This dynamic approach enables flexible design changes that would be impossible with traditional embedded resistive elements.
3Reliability
If traditional pin through-hole parts are used with metallic leads soldered into plated through-holes, then reliability is maintained, but component density and frequency of operation are limited
Solution Approach 1:
The invention utilizes the Z-direction (vertical dimension) for component insertion, allowing multiple components to be stacked through the PCB thickness. This three-dimensional arrangement significantly increases component density compared to traditional two-dimensional surface mounting, while maintaining reliable electrical connections through the conductive channels formed in the PCB.
Solution Approach 2:
The invention changes the connection parameter from traditional solder joints to conductive channel insertions. The conductive channels are formed by plating the inner walls of holes drilled through the PCB, creating reliable electrical pathways without requiring solder. This parameter change enables higher frequency operations by reducing parasitic inductance associated with traditional leaded components.
4Ease of manufacture
If traditional pin through-hole parts are used with metallic leads soldered into plated through-holes, then ease of manufacture is maintained, but frequency of operation is limited
Solution Approach 1:
The invention changes the electrical connection parameter from solder-based to conductive channel-based connections. The conductive channels are formed by electroplating copper on the inner walls of drilled holes, creating low-inductance pathways suitable for high-frequency operations. This parameter change maintains manufacturing simplicity while enabling frequencies that would be impossible with traditional soldered leads.
Data Source
AI summary
A Z-directed capacitor according to one embodiment includes a body having top, bottom and side surfaces, a cross-sectional shape that is insertable into a mounting hole in a printed circuit board, and a plurality of stacked support members. Each support member includes an annular plate mounted on a surface thereof. A first conductive side channel and a second conductive side channel are formed in the side surface and extend along a top-to-bottom dimension of the body. A first set of the annular plates electrically contact the first conductive side channel but not the second conductive side channel and a second set of the annular plates electrically contact the second conductive side channel but not the first conductive side channel. A third conductive side channel is formed in the side surface, extends along the top-to-bottom dimension of the body and is electrically separated from the annular plates.