Multilayer Ceramic Component Alkyl Acrylate Coating Moisture Resistance

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Solution Overview

Problem

Multilayer ceramic electronic components face degradation due to moisture penetration and ion migration, leading to reliability issues and short circuits when exposed to harsh environments with high temperatures and humidity, causing mechanical stress and hydrophilic oxide layer formation.

Innovation Solution

A multilayer ceramic electronic component design featuring a ceramic body with alternately stacked internal electrodes and a dielectric layer, along with external electrodes and a coating layer made of an alkyl(meth)acrylate-based polymer to prevent moisture penetration and enhance bonding strength, thereby suppressing ion migration and improving reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a plating layer is formed on the external electrode after sintering, then the electrical conductivity is improved, but the risk of moisture penetration and ion migration increases due to hydrophilic oxide layer formation

Engineering Contradiction:
Improveelectrical conductivityVSAvoidmoisture penetration
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

A coating layer comprising an alkyl(meth)acrylate-based polymer is introduced as an intermediary between the external electrode and the environment. This coating layer acts as a barrier that prevents moisture from reaching the hydrophilic oxide layer on the ceramic body surface, thereby blocking the pathway for moisture penetration and ion migration while allowing the plating layer to maintain its electrical conductivity function

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The external electrode structure is enhanced by combining multiple materials: the conductive plating layer is复合 with the protective alkyl(meth)acrylate-based polymer coating layer. This composite structure integrates the electrical conductivity of the metal plating layer with the moisture barrier properties of the polymer coating, solving both conductivity and moisture protection requirements simultaneously

Inventive Principle:
Principle #40Composite materials

2Temperature

If the component is exposed to high temperature and high humidity environment, then the operational capability is maintained, but ion migration occurs leading to short circuit

Engineering Contradiction:
Improvehigh temperature resistanceVSAvoidion migration resistance
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The alkyl(meth)acrylate-based polymer coating layer serves as a protective intermediary that covers the external electrode and ceramic body surface. This coating layer has low surface energy and hydrophobic properties, creating a barrier that prevents moisture from adhering to and penetrating through to the electrode, thereby suppressing ion migration even under high temperature and humidity conditions

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The surface energy parameter of the ceramic body is modified by applying the alkyl(meth)acrylate-based polymer coating. This changes the surface properties from hydrophilic (high surface energy) to hydrophobic (low surface energy), fundamentally altering the interaction between the surface and moisture, thereby preventing the initiation of ion migration pathways

Inventive Principle:
Principle #35Parameter changes

3Object-affected harmful factors

If a coating layer comprising an alkyl(meth)acrylate-based polymer is formed, then moisture resistance is improved, but the manufacturing process complexity increases

Engineering Contradiction:
Improvemoisture resistanceVSAvoidmanufacturing process
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The alkyl(meth)acrylate-based polymer coating is applied to the external electrode and ceramic body surface before final assembly and testing. This preliminary protective action ensures that the component is already protected against moisture penetration from the outset, preventing potential reliability issues before they can manifest during operation or testing

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The manufacturing process utilizes the low curing temperature parameter of the alkyl(meth)acrylate-based polymer, which can be cured at temperatures suitable for standard electronic component manufacturing. This parameter characteristic allows the coating to be applied and cured in existing manufacturing lines without requiring specialized high-temperature equipment, thereby limiting the increase in process complexity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively prevents moisture-induced degradation, reduces short circuit defects, and enhances the reliability of multilayer ceramic electronic components by preventing ion migration and improving bonding strength, ensuring better moisture resistance and mechanical stability.

Implementation Method 1

the first coating layer may include an alkyl(meth)acrylate-based polymer... preventing moisture penetration

Methodology Applied
Scientific EffectHydrophobic effect: Hydrophobe

Implementation Method 2

ion migration is suppressed... an ion migration phenomenon in which an electrode material migrates toward the opposite electrode occurs

Methodology Applied
Scientific EffectIon migration suppression:

Implementation Method 3

enhancing the reliability... improving bonding strength

Methodology Applied
Scientific EffectAdhesion: Adhesive

Data Source

PatentUS11705283B2Multilayer ceramic electronic component
Publication Date: 2023.07.18 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11705283B2 patent drawing
  • US11705283B2 patent drawing
  • US11705283B2 patent drawing

AI summary

A multilayer ceramic electronic component includes a ceramic body including a first internal electrode and a second internal electrode disposed to be alternately stacked with a dielectric layer interposed therebetween, a first external electrode connected to the first internal electrode and including a first electrode layer, a first conductive layer, and a first metal layer, a second external electrode connected to the second internal electrode and including a second electrode layer, a second conductive layer, and a second metal layer, and a first coating layer disposed on the ceramic body, the first electrode layer and the second electrode layer, wherein the first coating layer may include an alkyl(meth)acrylate-based polymer.