Multilayer Capacitor Electrode Plating for Embedding
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Solution Overview
Problem
Three-terminal embedded multilayer capacitors face issues with smoothness due to thick edge portions of the ground electrode, which can lead to reliability degradation and difficulties in embedding within substrates with limited space.
Innovation Solution
A multilayer capacitor design with a connecting electrode on one surface and external electrodes on opposing surfaces, where the external electrodes extend to cover the connecting electrode ends, using nickel or copper, and a nickel-tin or copper plating layer to enhance smoothness and reliability, with a thickness of 0.25 mm or less.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thick edge portion of ground electrode is used, then reliability is improved, but degree of smoothness deteriorates
Solution Approach 1:
The patent applies different plating layers to different regions of the ground electrode. A first plating layer (nickel-tin or copper) is applied to the main body, while a second plating layer is specifically applied to the edge portion. This local differentiation allows the edge portion to achieve smoothness suitable for embedding while maintaining the reliability provided by the thicker ground electrode structure.
2Volume of moving object
If capacitor thickness is reduced to 0.25 mm or less, then mounting space is improved, but manufacturing precision becomes more difficult
Solution Approach 1:
The patent specifies precise parameter ranges for the plating layers to achieve the desired thickness and smoothness. The first plating layer has a thickness of 1 μm to 5 μm, and the second plating layer has a thickness of 0.5 μm to 2 μm. These controlled parameter changes enable the capacitor to achieve thin overall thickness (0.25 mm or less) while maintaining manufacturing precision through the dual plating approach.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design secures a higher degree of smoothness for the ground electrode while preventing reliability degradation, enabling efficient embedding in substrates with minimal space and ensuring uniform plating and reduced risk of damage during laser processing.
Implementation Method 1
using nickel or copper, and a nickel-tin or copper plating layer to enhance smoothness and reliability
Data Source
AI summary
A multilayer capacitor includes a connecting electrode provided on a surface opposite to a surface on which the capacitor body is mounted, and a third external electrode and a fourth external electrode extend to cover opposing ends of the connecting electrode across a width of the capacitor body. The third and fourth external electrodes are disposed on respective side surfaces of the capacitor body opposite each other across the width, and contact respective first and second pluralities of internal electrodes disposed in the capacitor body.