Multilayer Ceramic Component Flat Electrode Ends
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Solution Overview
Problem
The existing methods for embedding electronic components in printed circuit boards face challenges in maintaining a consistent gap between external electrode band portions, leading to difficulties in adjusting their size and potential defects during via drilling, due to deviations caused by plating and printing processes.
Innovation Solution
A multilayer ceramic electronic component design with flat end portions of external electrodes formed using laser-cutting, where conductive layers of Ni and plating layers of Cu are printed and cut to ensure precise band portion alignment and reduced gap deviations, allowing for easier adjustment and secure connection areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If external electrodes are formed by plating and printing processes, then the mounting space is secured, but the gap between band portions shows large deviation and cannot be adjusted to desired size
Solution Approach 1:
The patent applies preliminary action by forming the conductive layers with predetermined patterns and dimensions before the plating process. The conductive layers are printed with precise gap dimensions, and then the plating process deposits metal onto these pre-formed patterns. This ensures that the final external electrodes have consistent gap dimensions without deviation, as the plating process merely fills in the pre-defined conductive layer patterns rather than creating the patterns themselves.
2Adaptability or versatility
If external electrodes are formed by dipping and plating, then the electronic component can be embedded, but it is difficult to adjust the size of the gap between band portions
Solution Approach 1:
The patent applies parameter changes by controlling the dimensions, patterns, and spacing of the conductive layers during the printing process. By adjusting the print parameters such as line width, spacing, and pattern geometry of the conductive layers, the gap size between band portions can be precisely controlled and adapted to different customer requirements. The plating process then maintains these dimensions without significant variation.
3Ease of manufacture
If band portions are formed by plating process, then external electrodes are created, but large deviation in gap between band portions occurs
Solution Approach 1:
The patent introduces an intermediary element - the conductive layer - that serves as a template or mask between the printing process and the plating process. The conductive layer is printed with precise gap dimensions and acts as a mediator that transfers the precise dimensional information to the final plated external electrodes. This intermediary conductive layer ensures that the plating process reproduces the desired gap dimensions without deviation, as the plating merely conforms to the pre-formed conductive layer patterns.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces gap deviations between band portions, enhances the connection reliability, and improves the manufacturing process by ensuring accurate drilling and reducing the risk of short-circuits, thereby securing mounting space and improving the integration density of electronic components.
Implementation Method 1
cutting the electrode layer using a laser beam to separate the electrode layer into first and second external electrodes of which cut surfaces of end portions are formed to be flat
Implementation Method 2
forming an electrode layer having a plating layer by performing plating on the conductive layer
Data Source
AI summary
A multilayer ceramic electronic component includes: a body having first to sixth surfaces, and including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed and exposed through the third and fourth surfaces, respectively; and first and second external electrodes disposed on the third and fourth surfaces of the body, respectively, and including first and second connected portions connected to the first and second internal electrodes, respectively, and first and second band portions extending from the first and second connected portions to portions of at least one of the first and second surfaces of the body, respectively. The external electrodes include conductive layers and plating layers, respectively, and surfaces of end portions of external electrodes are flat.