Multilayer Ceramic Component Sputtered Side Electrodes
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Solution Overview
Problem
Existing multilayer ceramic capacitor manufacturing methods result in thick outer electrodes, which increase the size of the finished product and can lead to reliability issues due to electrode continuity problems and plating defects when attempting to decrease thickness.
Innovation Solution
The use of a sputtering method to form side-face outer electrodes with a metal layer containing 3% or more of metals like Mg, Al, Ti, W, or Cr, and an outermost layer of Sn or Bi alloy, ensuring excellent adhesion and plating resistance, along with a conductive paste for end-face outer electrodes to achieve thin, reliable outer electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive paste is applied to end faces of unfired ceramic multilayer body followed by co-firing, then outer electrodes are formed, but the thickness of outer electrodes becomes large (10 μm or more), resulting in increased size of the finished product
Solution Approach 1:
The outer electrode formation process is segmented into two distinct parts: (1) forming a thin base layer by applying conductive paste to end faces and co-firing, and (2) forming the main electrode body by applying conductive paste to side faces and co-firing. This segmentation allows each part to be optimized independently - the end-face electrode provides reliable adhesion while the side-face electrode provides the necessary thickness and conductivity.
Solution Approach 2:
Different regions of the outer electrode are given different properties: the end-face portion uses a thicker conductive paste application to ensure strong adhesion and electrode continuity, while the side-face portion uses a thinner application to reduce overall thickness. This local differentiation resolves the contradiction between needing thickness for reliability and needing thinness for compact size.
2Length of moving object
If coating thickness of conductive paste is decreased to reduce outer electrode thickness, then electrode continuity is decreased at ridge portions, resulting in insufficient reliability
Solution Approach 1:
The electrode formation is divided into end-face electrode formation and side-face electrode formation. The end-face electrode is formed with sufficient thickness to ensure continuity and adhesion, while the side-face electrode is formed with reduced thickness. This segmentation allows thin overall dimensions while maintaining reliability at critical locations.
Solution Approach 2:
The end-face outer electrodes are formed first by applying conductive paste to end faces and co-firing. This preliminary action creates a reliable base layer that ensures electrode continuity and adhesion before the side-face electrodes are formed, preventing reliability issues that would occur if thin coating were applied uniformly.
3Length of moving object
If outer electrode thickness is decreased to reduce finished product thickness, then plating defects may occur and mounting strength may be insufficient
Solution Approach 1:
The outer electrode structure uses local quality differentiation where the end-face portion has sufficient thickness for plating and mounting, while the side-face portion is thinner. The end-face outer electrodes serve as the primary plating surfaces, providing the necessary thickness and mechanical strength for mounting, while the side-face electrodes provide electrical connection with minimal thickness contribution to overall size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for significantly reduced outer electrode thickness while maintaining high reliability and adhesion, preventing plating defects and improving mounting strength and postural stability in compact ceramic components.
Implementation Method 1
side-face outer electrodes formed by a sputtering method on side faces of the ceramic multilayer body
Data Source
AI summary
A multilayer ceramic electronic component having outer electrodes that each include an end-face outer electrode disposed on an end face of a ceramic multilayer body and side-face outer electrodes formed by a sputtering method on side faces of the ceramic multilayer body and electrically connected to the end-face outer electrode. A sputtering electrode layer of each of the side-face outer electrodes in contact with the ceramic multilayer body is composed of a material containing 3% by mass or more of a metal having a standard oxidation-reduction potential of −2.36 to −0.74 V, and an outermost sputtering electrode layer which is an outermost layer of each of the side-face outer electrodes is composed of at least one of Sn and Bi or an alloy containing 5% by mass or more of at least one of Sn and Bi.