Thin-Film Capacitor Core Waterproof Covering for Moisture Resistance
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Solution Overview
Problem
Existing thin-film capacitors face low production efficiency and inadequate moisture resistance, making them unsuitable for high temperature and humid environments, particularly in outdoor applications like photovoltaic inverters and charging piles.
Innovation Solution
A thin-film capacitor core with a covering film wound around the core body, featuring a base film with a waterproof layer and sprayed metal coating on the end surfaces, allowing for efficient production and enhanced moisture resistance through a winding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual coating with aluminum foil is used, then moisture resistance is improved, but production efficiency deteriorates
Solution Approach 1:
The patent replaces the manual mechanical coating process with an automated spray coating system. The spray coating apparatus automatically applies the aluminum foil coating to the capacitor core, eliminating manual labor while maintaining coating quality and moisture resistance, thereby significantly improving production efficiency.
Solution Approach 2:
The patent changes the application method parameters from manual coating to spray coating. By controlling spray parameters such as spray speed, coating thickness, and spray pattern, the process achieves consistent moisture protection while enabling high-speed automated production, resolving the contradiction between reliability and productivity.
2Reliability
If packaging material thickness is increased, then moisture resistance is improved, but device size and production cost increase
Solution Approach 1:
The patent uses a composite structure combining a thin base packaging material with a sprayed metal coating layer. This composite approach provides superior moisture resistance compared to thick packaging alone, while keeping the overall device size compact. The thin packaging material combined with the protective coating achieves better performance than thick material without coating.
Solution Approach 2:
The patent employs a thin packaging material film that is then coated with metal spray. This thin film approach, when combined with the protective coating, provides effective moisture barrier properties without increasing device volume, unlike using thick packaging material alone.
3Reliability
If packaging material thickness is increased, then moisture resistance is improved, but production cost increases
Solution Approach 1:
The patent creates a cost-effective composite structure using thin packaging material plus spray coating. This combination reduces material costs compared to thick packaging while achieving equal or superior moisture resistance. The spray coating process is also cost-efficient for high-volume production.
Solution Approach 2:
The patent uses a thin, cost-effective packaging material that is then enhanced with a protective coating. This approach replaces expensive thick packaging material with a combination of inexpensive thin material and economical spray coating, reducing overall production costs while maintaining reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves moisture resistance while maintaining production efficiency, enabling the thin-film capacitor to function effectively in harsh environmental conditions.
Implementation Method 1
the sprayed metal coating is applied to two end surfaces of the core body to form electrodes
Implementation Method 2
the waterproof layer is attached to the base film
Data Source
AI summary
A thin-film capacitor core that has a core body, a covering film and a sprayed metal coating provided at two ends of the core body to form electrodes. The covering film is wound around an outer circumferential surface of the core body; the covering film has a base film and a waterproof layer attached to the base film. A waterproof covering process for the thin-film capacitor core can be performed by means of winding using a winding machine for producing a core body, such that on the premise of ensuring production efficiency of the thin-film capacitor core, the moisture resistance of the thin-film capacitor core is improved. A thin-film capacitor loaded with the thin-film capacitor core, and a printed circuit board loaded with the thin-film capacitor are also provided.


