Resin composition, copper foil with resin, dielectric layer, copper-clad laminate, capacitor element, and printed wiring board with built-in capacitor
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Solution Overview
Problem
Existing resin compositions for capacitors in printed circuit boards face challenges in maintaining stable capacitance and high dielectric characteristics, especially at high temperatures, and achieving high adhesion to circuits.
Innovation Solution
A resin composition comprising an epoxy resin, a diamine compound, a polyimide resin, and a dielectric filler composed of a complex metal oxide, with a specific content of 60 to 85 parts by weight of dielectric filler, is used in the dielectric layer of capacitors to enhance capacitance stability and adhesion at high temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin compositions are used in capacitor dielectric layers, then manufacturing is simpler, but capacitance stability at high temperature deteriorates
Solution Approach 1:
The patent uses a composite resin composition combining epoxy resin, diamine compound, and polyimide resin in specific proportions (epoxy resin 15-80 parts, diamine compound 5-40 parts, polyimide resin 5-30 parts based on 100 parts epoxy resin). This composite approach leverages the complementary properties of each component: epoxy resin provides adhesion and mechanical strength, diamine compound enhances dielectric properties, and polyimide resin improves high-temperature stability, achieving capacitance stability that single-resin systems cannot provide
Solution Approach 2:
The patent optimizes specific parameter ranges to achieve high-temperature capacitance stability. The dielectric filler content is controlled at 60-85 parts by weight based on 100 parts solid content, and the resin component ratios are precisely defined. These parameter optimizations ensure the dielectric layer maintains stable electrical properties at elevated temperatures while managing composition complexity
2Reliability
If dielectric filler content is increased to improve dielectric characteristics, then adhesion to circuit deteriorates
Solution Approach 1:
The patent optimizes the dielectric filler content parameter within the range of 60-85 parts by weight based on 100 parts solid content in the resin composition. This optimized range achieves a balance between dielectric characteristics and adhesion performance, preventing excessive filler content from compromising circuit bonding while ensuring sufficient dielectric properties for capacitor function
Solution Approach 2:
The composite resin system with specific ratios of epoxy resin, diamine compound, and polyimide resin creates a matrix that maintains adhesion strength even with high dielectric filler content (60-85 parts). The resin components work synergistically to bond the filler particles and adhere to the circuit, allowing high filler loading without sacrificing adhesion
3Productivity
If thin and compact capacitor structure is implemented for high functionality, then capacitance stability at high temperature deteriorates
Solution Approach 1:
The patent employs a composite dielectric layer composition that achieves both thin/compact structure and high-temperature stability. The specific combination of epoxy resin, diamine compound, and polyimide resin with optimized ratios creates a dielectric material with superior thermal stability that maintains capacitance even in thin-layer capacitor configurations, enabling high functionality without sacrificing reliability
Solution Approach 2:
The patent defines specific parameter ranges for the resin composition (epoxy resin 15-80 parts, diamine compound 5-40 parts, polyimide resin 5-30 parts, dielectric filler 60-85 parts) that enable thin and compact capacitor structures to maintain capacitance stability at high temperatures. These optimized parameters allow reduced capacitor size while preserving thermal performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition effectively controls the decrease in capacitance or dielectric constant at high temperatures, ensuring high dielectric characteristics and strong adhesion to circuits, thereby supporting high functionality in electronic devices.
Implementation Method 1
a dielectric filler composed of a complex metal oxide comprising at least two elements selected from the group consisting of Ba, Ti, Sr, Pb, Zr, La, Ta, and Bi
Data Source
AI summary
A resin composition for use in a dielectric layer of a capacitor is provided that can control a decrease in capacitance or dielectric constant at high temperature and ensure high dielectric characteristics and high adhesion of the composition to a circuit. The resin composition contains a resin component containing an epoxy resin, a diamine compound, and a polyimide resin; and a dielectric filler composed of a metal oxide containing at least two elements selected from the group consisting of Ba, Ti, Sr, Pb, Zr, La, Ta, and Bi. The content of the dielectric filler is 60 to 85 parts by weight on the basis of 100 parts by weight of solid content in the resin composition.