Multilayer Capacitor Electrode Cutout Structure for Low ESR Durability

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Solution Overview

Problem

Multilayer capacitors used in automotive applications face challenges in durability against external vibrations and deformation, leading to potential cracking and increased equivalent series resistance (ESR) due to the limitations of existing conductive resin layers.

Innovation Solution

A multilayer capacitor design featuring a conductive resin layer with cutout portions that expose edges of the conductive layer, allowing direct contact with a plating layer, and covering only specific corners to enhance durability and reduce ESR, while maintaining flexibility in chip orientation during mounting.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conductive resin layer completely covers the conductive layer, then protection against external vibrations is improved, but electrical conductivity increases due to increased ESR

Engineering Contradiction:
Improvedurability against vibrationsVSAvoidequivalent series resistance
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The conductive resin layer is selectively applied to cover only specific corners of the connection portion rather than the entire surface. This local coverage provides vibration protection where most needed at the corners while leaving other areas exposed to maintain electrical conductivity and reduce ESR.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The conductive resin layer is divided into multiple separate regions, each covering a specific corner area. This segmentation allows different parts of the connection portion to have different levels of protection and conductivity, optimizing both durability and electrical performance.

Inventive Principle:
Principle #1Segmentation

2Reliability

If the conductive resin layer is made thick to improve vibration resistance, then durability is improved, but flexibility in chip orientation is lost

Engineering Contradiction:
Improvedurability against deformationVSAvoidchip orientation flexibility
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The conductive resin layer is applied locally at corner regions rather than uniformly across the entire connection portion. This localized approach provides deformation resistance at critical corners while maintaining overall flexibility and adaptability for different chip orientations.

Inventive Principle:
Principle #3Local quality

3Reliability

If the conductive resin layer covers the entire connection portion, then protection is improved, but manufacturing complexity increases

Engineering Contradiction:
Improveprotection against external stressVSAvoidconductive resin layer structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The conductive resin layer is segmented into discrete corner regions rather than forming a continuous covering. This simplifies the manufacturing process by reducing the complexity of applying and patterning the resin layer while still providing effective protection.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11848159B2Multilayer capacitor and board for mounting the same
Publication Date: 2023.12.19 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11848159B2 patent drawing
  • US11848159B2 patent drawing
  • US11848159B2 patent drawing

AI summary

A multilayer capacitor includes a capacitor body including a dielectric layer and a plurality of internal electrodes, and a pair of external electrodes disposed on opposing ends of the capacitor body and connected to exposed portions of the internal electrodes, wherein the external electrodes respectively include a conductive layer including a connection portion formed on one end surface of the capacitor body and connected to the internal electrode and a band portion extending from the connection portion to a portion of a neighboring surface of the capacitor body, a conductive resin layer covering a corner of the connection portion of the conductive layer and having a cutout portion so that a portion of an edge of the connection portion is exposed, and a plating layer covering the conductive layer and the conductive resin layer and contacting a portion of the conductive layer due to the cutout portion.