Multilayer Capacitor Electrode Segmentation for L-Margin Bending
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Solution Overview
Problem
In multilayer capacitors, the high glass transition temperature of internal electrodes hinders bending in L-margin regions during manufacturing, leading to reliability issues due to delamination and moisture ingress, which degrades the mechanical strength and adhesion between dielectric sheets.
Innovation Solution
The widths of connection sections of internal electrodes are decreased to enhance bending in L-margin regions, improving adhesion and density by forming pattern removing regions that are not continuously overlapped, thereby increasing mechanical strength and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If internal electrodes with high glass transition temperature are used, then electrical connection reliability is improved, but bending in L-margin regions is hindered leading to delamination and reduced mechanical strength
Solution Approach 1:
The internal electrode is segmented into two distinct width portions: a first width portion in the overlapping region and a second width portion in the L-margin region. This segmentation allows the electrode to provide strong electrical connection where needed while enabling sufficient bending in margin regions to prevent delamination and improve mechanical strength.
Solution Approach 2:
The internal electrode exhibits local quality variation through different width portions tailored for different functional requirements. The first width portion provides robust electrical connection in the overlapping region, while the second width portion enables bending capability in L-margin regions, optimizing both reliability and mechanical strength locally.
2Ease of manufacture
If uniform width internal electrodes are used, then manufacturing simplicity is maintained, but delamination and moisture ingress occur reducing capacitor reliability
Solution Approach 1:
The internal electrode pattern is divided into segments with different widths - a first width portion in overlapping regions and a second width portion in L-margin regions. This segmentation prevents delamination and moisture ingress by enabling proper bending in margin regions while maintaining manufacturability through standard printing processes.
Solution Approach 2:
Different width characteristics are applied locally to different regions of the internal electrode. The first width portion in overlapping regions ensures electrical connectivity, while the second width portion in L-margin regions prevents delamination, achieving high reliability without compromising manufacturing feasibility.
3Strength
If connection sections of internal electrodes are reduced in width, then bending in L-margin regions is enhanced improving adhesion, but electrical connection area is decreased
Solution Approach 1:
The internal electrode is segmented into a first width portion for electrical connection in overlapping regions and a second width portion for bending in L-margin regions. This ensures sufficient electrical connection area is maintained while enabling enhanced bending and adhesion in margin regions where the electrode width is reduced.
Solution Approach 2:
The electrode width is optimized locally: maintained at first width in overlapping regions to ensure electrical connection, and reduced to second width in L-margin regions to enhance bending and adhesion. This local differentiation resolves the contradiction between connection area and adhesion strength.
Data Source
AI summary
Disclosed herein are a multilayer capacitor, a method for manufacturing the same, and an electronic device using the same. A multilayer capacitor including internal electrodes stacked in a dielectric so as to be spaced apart from each other, alternately connected to external electrodes formed on both sides of the dielectric, and formed so that width sizes of connection sections connected to the external electrodes are decreased as compared with those of overlapped sections overlapped with each other while vertically neighboring to each other in at least portions of a stacked structure is suggested. In addition, an electronic device using the multilayer capacitor and a method for manufacturing the multilayer capacitor are suggested.


