Multilayer Capacitor Electrode Spacing to Prevent Warpage Cracks
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Solution Overview
Problem
The miniaturization of electronic components leads to increased warpage of circuit boards, causing cracks in multilayer capacitors, which can result in short-circuit defects, potentially damaging other components due to excessive current flow.
Innovation Solution
A multilayer capacitor design with external electrodes and internal electrodes structured to prevent cracks by spacing body portions away from virtual lines connecting connection and band portions, reducing the likelihood of short-circuit defects and allowing the capacitor to remain in an open state even if cracks occur.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of the dielectric layer is decreased to achieve miniaturization, then the size of the multilayer capacitor is reduced, but the reliability deteriorates due to increased susceptibility to cracks from circuit board warpage
Solution Approach 1:
The patent applies preliminary action by pre-positioning the internal electrodes at specific locations that are spaced apart from the virtual lines connecting distal ends of connection portions and band portions. This preliminary positioning ensures that even if cracks occur due to circuit board warpage, they will not propagate through the internal electrodes, thus preventing short-circuit defects before they can occur.
Solution Approach 2:
The patent uses the spatial arrangement of internal electrodes as an intermediary protective measure. By positioning the internal electrodes away from the virtual lines that represent potential crack paths, the design creates a buffer zone that prevents direct contact between cracks and conductive elements, thereby maintaining reliability even when cracks occur.
2Length of stationary object
If circuit board thickness is decreased to achieve slimness, then the overall device profile is reduced, but warpage increases causing cracks in mounted multilayer capacitors
Solution Approach 1:
The patent applies preliminary anti-action by designing the internal electrode configuration to counteract the harmful effects of circuit board warpage. The specific spacing arrangement of internal electrodes away from virtual lines creates a structural configuration that is inherently resistant to crack propagation, effectively pre-defending against the instability caused by thin circuit board warpage.
3Reliability
If cracks occur in conventional multilayer capacitors, then the capacitor fails, but it fails in a short-circuit state causing excessive current flow and damage to other components
Solution Approach 1:
The patent converts the potential harm of cracks into a beneficial outcome by strategically positioning internal electrodes away from virtual lines. When cracks do occur, they naturally follow the virtual line paths and stop at the spaced-apart internal electrodes, preventing short-circuits. This transforms what would normally be a harmful crack into a benign event that results in an open circuit state rather than a dangerous short-circuit condition.
Data Source
AI summary
A multilayer capacitor and a board having the same includes external electrodes and internal electrodes. The external electrodes include connection portions formed on a mounting surface of a capacitor body and band portions formed on side surfaces of the capacitor body, and the internal electrodes include body portions overlapping each other and lead portions extended from the body portions to the mounting surface of the capacitor body, to thereby be connected to the connection portions of the external electrodes. The body portions are formed to be spaced apart from virtual lines connecting distal ends of the connection portions and distal ends of the band portions to each other.