Multilayer Capacitor Frame Terminal Segmentation for Stress Relief
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Solution Overview
Problem
Multilayer capacitors face challenges in maintaining high thermal and mechanical reliability due to direct contact with circuit boards, leading to stress transfer and potential delamination, which increases the component height and risk of warpage cracks.
Innovation Solution
The design incorporates a frame terminal structure with conductive adhesives and a sealing part to create space between the external electrodes and frame terminals, allowing for elastic deformation and reducing stress interfaces, while maintaining a compact height.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a metal frame is adhered to the side surface of the multilayer capacitor to prevent stress transfer, then reliability is improved, but the component height increases
Solution Approach 1:
The metal frame is divided into multiple segments (first metal frame segment, second metal frame segment, third metal frame segment) along the height direction. This segmentation allows the frame to provide stress protection while reducing the overall component height compared to a single continuous frame extending the full height.
Solution Approach 2:
The patent transitions from a single-dimensional vertical frame structure to a multi-dimensional segmented structure with frames positioned at different heights and orientations, optimizing stress distribution without requiring full-height frame coverage.
2Reliability
If the length of the metal frame is increased to secure sufficient non-adhered portion, then resistance to warpage cracks is improved, but the component height increases
Solution Approach 1:
The metal frame is segmented into multiple portions (first, second, and third metal frame segments) positioned at different heights. This allows sufficient non-adhered length to be distributed across segments rather than requiring a single long continuous frame, thereby maintaining crack resistance without increasing overall height.
Solution Approach 2:
Instead of adhering the frame continuously along the entire height, the patent uses partial adhesion at specific segments, providing sufficient stress relief and crack resistance through targeted reinforcement rather than full-length coverage.
3Reliability
If adhesives are used to adhere plating layers and metal frame, then electrical connection is improved, but delamination occurs due to thermal expansion differences
Solution Approach 1:
A buffer layer is introduced as an intermediary between the plating layer and the metal frame. This buffer layer has thermal expansion properties that intermediate between the plating layer and metal frame, reducing thermal stress and preventing delamination while maintaining electrical connection through the conductive adhesive.
Solution Approach 2:
The patent employs a composite structure with multiple materials (plating layer, buffer layer, metal frame, conductive adhesive) where each material is selected for its specific properties. The buffer layer acts as a transition material that reconciles the thermal expansion mismatch between dissimilar materials, preventing interface failure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances thermal and mechanical stress resistance, improves reliability by absorbing deformation stress, and maintains a reduced component height without increasing the frame length, thus addressing the limitations of existing multilayer capacitors.
Implementation Method 1
a first conductive adhesive disposed between the first external electrode and an upper portion of the first side frame and between the first external electrode and the first top frame; and a second conductive adhesive disposed between the second external electrode and an upper portion of the second side frame and between the second external electrode and the second top frame
Implementation Method 2
delamination may occur in each interface due to a difference in coefficients of thermal expansion between adhesives used to adhere plating layers of external electrodes of the multilayer capacitor and the metal frame to each other
Data Source
AI summary
A multilayer electronic component includes: a first frame terminal including a first side frame, a first bottom frame and a first top frame; a second frame terminal including a second side frame, a second bottom frame and a second top frame; an electronic component including first and second external electrodes, and disposed between the first and second side frames; a first conductive adhesive disposed between the first external electrode and an upper portion of the first frame terminal; and a second conductive adhesive disposed between the second external electrode and an upper portion of the second frame terminal, wherein space portions are provided between the first and second external electrodes and lower portions of the first and second side frames and between the first and second external electrodes and the first and second bottom frames, respectively.