Multilayer Capacitor Frame Bonding for Low-Height Vibration Durability
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Solution Overview
Problem
Multilayer capacitors used in electronic devices face challenges in maintaining durability against vibrations and deformation while minimizing mounting height and equivalent series inductance (ESR), which is essential for eco-friendly and electrical vehicles, as increased thickness and height compromise miniaturization and reliability.
Innovation Solution
The use of a metal frame bonded to a multilayer capacitor with an adhesive layer comprising a solder layer and a conductive resin layer, where the conductive resin layer is designed to absorb external forces, reducing the need for increased mounting height and enhancing warpage strength without increasing ESR.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the mounting height of the multilayer capacitor is increased to improve durability against vibrations and warpage, then the warpage strength is improved, but the equivalent series inductance (ESR) increases and the miniaturization trend is compromised
Solution Approach 1:
The adhesive layer is segmented into two distinct layers: a solder layer and a conductive resin layer. The solder layer provides strong bonding and low ESR, while the conductive resin layer absorbs vibrations and stresses. This segmentation allows each layer to perform its specific function optimally, resolving the contradiction between low mounting height and high durability.
Solution Approach 2:
The adhesive layer uses a composite structure combining solder material and conductive resin material. This composite approach allows the adhesive layer to simultaneously achieve low ESR (from solder) and vibration absorption (from conductive resin), enabling low mounting height while maintaining high warpage strength and durability.
2Reliability
If the thickness of the multilayer capacitor is increased to improve durability, then the resistance against vibrations and deformation is improved, but the component size increases which is not suitable for miniaturization
Solution Approach 1:
The conductive resin layer acts as an intermediary between the solder layer and the multilayer capacitor body. It absorbs vibrations and stresses before they reach the capacitor, providing durability without requiring increased capacitor thickness. This mediator approach allows small component size while maintaining high reliability against vibrations.
3Strength
If a general metal frame is used to mount the multilayer capacitor, then the structural support is provided, but the mounting height must be increased which increases ESR and compromises miniaturization
Solution Approach 1:
The invention changes the parameters of the adhesive layer by using a dual-layer structure with specific material properties. The solder layer provides strong mechanical bonding, while the conductive resin layer provides vibration damping. This parameter change allows the mounting height to be reduced while maintaining structural support and durability, resolving the contradiction between structural strength and low mounting height.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration maintains low mounting height, improves durability by absorbing vibrations, and keeps ESR low, addressing the need for enhanced reliability and miniaturization in electronic components.
Implementation Method 1
a conductive resin layer designed to absorb external forces, reducing the need for increased mounting height and enhancing warpage strength without increasing ESR
Implementation Method 2
an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer
Data Source
AI summary
An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.