Capacitor Unit Heat Transfer Members for Thermal Management

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Solution Overview

Problem

Capacitor units in electronic devices, especially those with large capacitance, face insufficient cooling due to rising internal temperatures, limiting current flow and design flexibility due to temperature constraints.

Innovation Solution

Incorporation of heat transfer members adjacent to capacitor elements to dissipate heat internally, reducing temperature increases and enhancing cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If a capacitor unit with large capacitance is installed in the housing, then the power conversion capability is improved, but the temperature of capacitor elements increases due to insufficient cooling

Engineering Contradiction:
Improvepower conversion capabilityVSAvoidtemperature of capacitor elements
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

A heat transfer member is introduced as an intermediary between the capacitor elements and the surrounding air. This heat transfer member has high thermal conductivity and is in direct contact with the capacitor elements, serving as a mediator to efficiently transfer heat from the capacitor elements to the air, thereby resolving the temperature increase problem while maintaining large capacitance operation

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If the allowable temperature of the film in capacitor elements is not sufficiently high, then the current flow capability is limited, but increasing the film temperature rating increases device complexity

Engineering Contradiction:
Improvecurrent flow capabilityVSAvoiddevice complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The thermal management approach changes the operating temperature parameters of the capacitor elements by introducing active heat transfer. This allows the system to maintain higher current flow capability by controlling the temperature through the heat transfer member, rather than relying solely on increasing the film's inherent temperature rating, thus avoiding increased device complexity

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively disperses heat generated in capacitor elements, reducing internal temperature increases and allowing for higher current flow and design flexibility by maintaining lower maximum temperatures within the capacitor elements.

Implementation Method 1

The one or more heat transfer members internally dissipate heat received from at least one capacitor element of the plurality of capacitor elements

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Data Source

PatentUS20240222008A1Capacitor unit and electronic device
Publication Date: 2024.07.04 MITSUBISHI ELECTRIC CORP
  • US20240222008A1 patent drawing
  • US20240222008A1 patent drawing
  • US20240222008A1 patent drawing

AI summary

A capacitor unit includes a plurality of capacitor elements and one or more heat transfer members located adjacent to at least one capacitor element of the plurality of capacitor elements. The one or more heat transfer members internally dissipate heat received from at least one capacitor element of the plurality of capacitor elements.