Thin-Film Capacitor Insulating Layer Isolation
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Solution Overview
Problem
In thin-film capacitors, direct contact between the adhesion layer of the terminal electrode and the dielectric layer can lead to degradation of electrical characteristics, especially with thinner upper electrode layers, resulting in reduced withstand voltage and insulation resistance.
Innovation Solution
A thin-film capacitor design that includes an insulating layer between the upper electrode layer and the terminal electrode, with a conductive layer extending through the insulating layer to electrically connect them, using materials with lower reducing power than the adhesion layer to prevent direct contact and reduce reduction reactions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the upper electrode layer is made thin to reduce component size, then the miniaturization is achieved, but the adhesion layer may directly contact the dielectric layer causing degradation of electrical characteristics
Solution Approach 1:
An insulating layer is introduced as an intermediary between the upper electrode layer and the terminal electrode (specifically the adhesion layer). This insulating layer prevents direct contact between the adhesion layer and dielectric layer, eliminating the harmful reduction reaction while still allowing electrical connection through a separate conductive layer that extends through the insulating layer.
2Strength
If the adhesion layer is used to secure adhesion with the protective film, then the adhesion is improved, but the reduction reaction of the dielectric layer is promoted when the upper electrode layer is thin or defective
Solution Approach 1:
The insulating layer serves as a mediator that physically separates the adhesion layer from the dielectric layer. This prevents the adhesion layer's reducing metal from contacting and reacting with the dielectric layer, thereby suppressing the harmful reduction reaction while maintaining the adhesion layer's function of bonding to the protective film.
Solution Approach 2:
The conductive layer is designed to extend through the insulating layer to provide localized electrical connection between the upper electrode layer and terminal electrode, while the insulating layer maintains its overall insulating property. This local quality change allows simultaneous achievement of electrical connectivity and prevention of harmful contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration isolates the upper electrode layer from the terminal electrode, preventing adhesion layer contact with the dielectric and suppressing reduction reactions, thereby enhancing the reliability and maintaining electrical characteristics of the thin-film capacitor.
Implementation Method 1
an insulating layer provided between the upper electrode layer and the terminal electrode for isolating the upper electrode layer from the terminal electrode
Implementation Method 2
a conductive layer provided so as to extend through the insulating layer in contact with the adhesion layer for electrically connecting the upper electrode layer and the terminal electrode
Implementation Method 3
a terminal electrode including an adhesion layer, a seed layer deposited on the adhesion layer, and a plating layer provided on the seed layer
Data Source
AI summary
To provide a thin-film capacitor capable of preventing the degradation of electrical characteristics caused by direct contact between an adhesion layer of a terminal electrode and a dielectric layer, to increase the reliability. The thin-film capacitor comprises: a dielectric layer deposited on a base electrode; an upper electrode layer deposited on the dielectric layer; a terminal electrode including an adhesion layer, a seed layer, and a plating layer; a resin layer for wiring provided between the upper electrode layer and the terminal electrode for isolating the upper electrode layer from the terminal electrode; and a wiring layer provided so as to extend through the resin layer for wiring in contact with the adhesion layer for electrically connecting the upper electrode layer and the terminal electrode, wherein a composition of the wiring layer differs from that of the adhesion layer of the terminal electrode, and wherein a reducing power of the wiring layer to the dielectric layer is smaller than that of the adhesion layer.