A thin-film device uses a close-contact layer to protect copper wiring electrodes from environmental damage.
An insulating layer isolates the upper electrode from the terminal electrode in a thin-film capacitor design.
An interlayer increases the Schottky barrier height at the electrode interface.
A cross-linked water-soluble copolymer forms a buffer layer pattern that acts as an etching mask, eliminating voids and reducing manufacturing costs.
Mixed metal powders with different melting points create a porous sintered body that balances electrostatic capacitance and mechanical strength.
A dielectric ink composition enables precise printing of ultracapacitor components.
Multistage vias connect stacked electrode layers to pads in a thin-film capacitor body.
A thin-film capacitor uses a protective layer to absorb mechanical stress from outer connecting terminals.
Amorphous hydrocarbon thin films achieve high dielectric constants while suppressing leakage current and interface traps in scaled semiconductor nodes.