Capacitor Electrode Structure With Intermetallic Bonding for Low ESR

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Solution Overview

Problem

Conventional capacitor components with conductive resin layers have high equivalent series resistance (ESR) due to high resistance and inadequate adhesion between electrode layers, leading to potential peeling issues under mechanical and thermal stress.

Innovation Solution

A capacitor component design featuring a body with dielectric and internal electrode layers, external electrodes with spaced first electrode layers, a second electrode layer comprising a base resin and conductive connection portions, and an intermetallic compound between the first and second electrode layers to enhance bonding and reduce ESR.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conductive resin layer is applied to the external electrode to absorb stress and prevent cracks, then reliability is improved, but equivalent series resistance increases

Engineering Contradiction:
Improvebonding force between electrode layersVSAvoidequivalent series resistance
Core Design Contradiction:
ReliabilityVSLoss of energy

Solution Approach 1:

The patent uses a composite structure consisting of a resin layer combined with an intermetallic compound layer. The resin layer provides mechanical stress absorption and adhesion, while the intermetallic compound layer provides low electrical resistance. This composite approach allows the external electrode to simultaneously achieve high reliability through stress resistance and low ESR through excellent electrical conductivity.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The intermetallic compound is selectively formed only at the interface between the resin layer and the external electrode, rather than throughout the entire electrode structure. This localized application ensures that the electrical connectivity is enhanced precisely where needed for current flow, while the resin layer continues to provide mechanical protection and stress absorption in other regions.

Inventive Principle:
Principle #3Local quality

2Reliability

If a conductive resin layer is applied to protect against mechanical and thermal stress, then reliability is improved, but adhesion between electrode layers deteriorates

Engineering Contradiction:
Improveprotection against mechanical and thermal stressVSAvoidadhesion between electrode layers
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The combination of resin and intermetallic compound creates a composite interface structure where each material performs its specialized function. The resin provides mechanical compliance and stress absorption, preventing delamination under thermal cycling and mechanical loading, while the intermetallic compound provides strong metallurgical bonding and electrical connectivity, ensuring excellent adhesion between the electrode layers.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The intermetallic compound acts as an intermediary layer between the resin and the external electrode, facilitating strong adhesion. It serves as a transition zone that bonds metallurgically to both the resin-containing matrix and the underlying electrode, ensuring that the protective resin layer remains firmly attached to the electrode during mechanical and thermal stress events.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design improves bonding force and electrical connectivity between internal and external electrodes, reducing equivalent series resistance and enhancing the component's reliability against mechanical and thermal stress.

Implementation Method 1

an intermetallic compound disposed only between each of the first electrode layers and the second electrode layer

Methodology Applied
Scientific EffectIntermetallic compound formation: Chemical Bonding

Data Source

PatentUS11823844B2Capacitor component
Publication Date: 2023.11.21 SAMSUNG ELECTRO MECHANICS CO LTD
  • US11823844B2 patent drawing
  • US11823844B2 patent drawing
  • US11823844B2 patent drawing

AI summary

A capacitor component includes a body including a dielectric layer and an internal electrode layer; and an external electrode disposed on one surface of the body, wherein the external electrode includes first electrode layers disposed on the one surface of the body to be spaced apart from each other, and covering a region of the one surface of the body through which the internal electrode layer is exposed; a second electrode layer including a base resin and a conductive connection portion disposed in the base resin, and disposed on the one surface of the body to cover the first electrode layers; and an intermetallic compound disposed only between each of the first electrode layers and the second electrode layer.