Multilayer Capacitor Metal Frame Vibration Suppression
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Solution Overview
Problem
Multilayer capacitors generate acoustic noise and high-frequency vibrations due to piezoelectric properties, which can be perceived as abnormal sounds in quiet environments and degrade device quality, and cause malfunctioning in sensors used in IT and industrial fields.
Innovation Solution
A multilayer electronic component design featuring a capacitor body with internal electrodes stacked parallel to a mounting surface, external electrodes connected to metal frames with solder pockets and stress-suppressing portions, and an encapsulant covering the components to reduce vibration transmission and acoustic noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a multilayer capacitor with piezoelectric dielectric material is used, then high capacitance and compact size are achieved, but acoustic noise and high-frequency vibrations are generated
Solution Approach 1:
A damping layer is introduced as an intermediary between the capacitor body and the PCB board. This damping layer absorbs and dissipates the piezoelectric vibrations generated by the capacitor, preventing them from being transmitted to the board and causing acoustic noise or sensor interference, while allowing the capacitor to maintain its high capacitance density
Solution Approach 2:
The piezoelectric effect that causes harmful vibrations is converted into a beneficial feature by using the same property for active vibration cancellation. A piezoelectric actuator is driven with a counter-phase signal to generate opposing vibrations that cancel out the harmful piezoelectric vibrations, transforming the harmful effect into a solution
2Device complexity
If the capacitor body is directly mounted on the PCB board, then simple installation and compact layout are achieved, but vibration transmission to the board occurs
Solution Approach 1:
A damping layer is positioned between the capacitor body and the PCB board as a mediator. This layer serves as a vibration isolation interface that absorbs mechanical vibrations while maintaining electrical insulation, preventing vibration transmission to the board without adding complex mounting structures
Solution Approach 2:
A flexible damping film or layer is applied to the capacitor body or mounting surface. This thin flexible layer provides vibration absorption and isolation while maintaining a simple, compact mounting structure that does not increase device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses acoustic noise and high-frequency vibrations, enhancing device reliability and preventing sensor malfunctions by minimizing vibration transmission and acoustic noise across the audible frequency range.
Implementation Method 1
A multilayer capacitor, as a multilayer electronic component, is formed of a dielectric material, and since the dielectric material may have piezoelectric properties, the dielectric material may be deformed in synchronization with a voltage applied thereto.
Implementation Method 2
first and second metal frames having first and second solder pockets and including first and second vertical portions, first and second upper horizontal portions extending from upper ends of the vertical portions and covering the first and second band portions, respectively
Data Source
AI summary
A multilayer electronic component includes a multilayer capacitor including a capacitor body in which internal electrodes are stacked to be parallel with respect to a mounting surface and external electrodes disposed on opposing end surfaces of the capacitor body, respectively, and a metal frame having a solder pocket and including a vertical portion, an upper horizontal portion extending from an upper end of the vertical portion, and a lower horizontal portion extending from a lower end of the vertical portion, the upper horizontal portion connected to an upper band portion of each of the external electrodes. 0.1≤G/CT≤0.7 is satisfied, in which CT is a height of the vertical portion and G is a distance between the lower band portion of each of the external electrodes and a lower end of the metal frame.