Printed Circuit Assembling TRIZ Cases

Modified PCB alignment features offset LED mounting errors, achieving sub-100 micron precision with secondary optics.

A protective film shields drive integrated circuits from external mechanical damage.

Composite insulation walls prevent electric shorts between adjacent capacitors while enabling higher mounting density in embedded substrates.

A printed wiring board features a solder-resist layer with an inward protruding flat surface to enhance pad adhesiveness.

A board assembly with a recessed cable space enables automated inner conductor soldering.

A buffer layer with low wetting angle absorbs excess solder, preventing droplet formation and protecting active structures from damage.

A method embeds electronic components in insulating layers using shadow masks for precise positioning.

Interchangeable mounting bases allow building control user interfaces to tilt or rotate, resolving fixed-position constraints in cramped utility rooms.

A wiring board uses segmented substrate openings to house electronic devices alongside conductive patterns on boundary portions.

Multilayer anisotropic conductive films with differential thermal expansion improve particle capture and connection reliability under high temperature.

Differentiating resin insulation layer thermal expansion coefficients offsets warping caused by mismatched material properties during temperature fluctuations.

A compressively-stressed glass substrate fragments upon intrusion to destroy attached electronic components.

A component mounting system calculates position correction data from solder paste deviations to align electronic components on individual substrates.

Integrates a magnetic element within an insulating layer on a conductive structure to boost inductance while reducing power loss.

A transporter moves undersupporting devices to a delivering unit for automatic installation.

A lead-free solder alloy composition with specific silver, copper, and antimony ranges maintains ductile strength at elevated temperatures.

Local measuring systems resolve measurement range versus precision contradictions by positioning sensors near the substrate to reduce geometrical deviations.

A multilayer capacitor uses metal frames with solder pockets to suppress acoustic noise and high-frequency vibrations.

A Bi-Sn solder paste with minimal volumetric expansion enables reliable lead-free step soldering.

Alignment marks guide component placement to resolve copper foil warping and maintain laminate flatness.

Integrating electrical circuits into a matrix-permeable composite panel reduces aircraft weight by 1-35% while eliminating extensive wiring harnesses.

Plating through hole filling and grinding create high-density board structures that resolve manufacturing precision constraints.

Mechanical pressure connects protruding chiplet posts to backplane pads, reducing manufacturing costs and material waste during substrate interconnection.

A preform plastic sheet melts during reflow to form a conformal coating, bypassing underfill capillary flow limitations and reducing coverage time.

Segmented outer electrodes on ceramic bodies reduce acoustic noise by minimizing vibration transmission to mounting substrates.

A patterned substrate modifies surface energy to control adhesive wetting angle, resolving solder joint reliability issues in compact electronic packaging.

A stacked spacer unit connects substrates using solder balls and a metal post to maintain vertical distance.

A solder composition uses a specific solvent blend to enhance fluidity and gas release during printing.

Bridge leads spanning cavities enable conformal anchor interconnects that prevent lateral expansion and shorting while increasing I/O capacity.

A flux composition blends acrylic resin and rosin to maintain solder paste fluidity under shear force.

Flexible leads enable fast assembly and reduce scrap by aligning heat transfer surfaces without costly grinding.

A column electrode design equalizes current density across solder interfaces through specific dimensional ratios.

Replacing gold plating with a high-decomposition organic film reduces production complexity while maintaining oxidation prevention during solder reflow.

Oblique sidewall mounting eliminates bond wires and over molding, resolving power handling and thermal dissipation constraints in compact packages.

Pre-heats a substrate below its damage threshold before applying a light pulse to a chip, preventing thermal damage while ensuring strong bonding.

A package via filled with conductive polymer increases effective series resistance in power delivery circuits.

Elastic metal wire antenna engages through a circuit board hole to establish electrical contact via mechanical retention.

A holding plate with through holes positions probes while solder cream fills enlarged openings to form a fillet between probe ends and connection pads.

A fuse element uses an elastic hook to retain on a circuit board without plastic deformation.

A printed circuit integrates an antenna and power source on a substrate to supply energy to an RFID chip.

A package structure embeds semiconductor chips within insulating layers to expand inner wiring layout area.

Tin-silver-copper solder alloy with 0.05 to 0.2 mass% silver suppresses void generation while maintaining fatigue resistance.

A semiconductor light emitting device display uses a conductive adhesive layer to electrically connect electrodes and enable fine pitch arrangement.

Annular member absorbs gap variations to protect solder bumps, maintaining airtightness and cooling efficiency.

Segmented cavities on the chip island second face control solder volume to minimize conduction distance and reduce electromagnetic inductance.

Extender tabs offset severed traces from conductive structures, preventing shorts during singulation.

Merging individual films into a single large sheet enables mass attachment, resolving the trade-off between alignment precision and manufacturing time.

Pre-bends radial component leads and cuts them obliquely to eliminate post-insertion bending steps.

Melting metal filler reduces thermal stress concentration on joining surfaces during temperature variations.

Ridge-shaped contacts on a carrier device reduce mechanical stress from CTE mismatch while improving heat dissipation.