Electronic Sub-Assembly Embedding Power Components
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Solution Overview
Problem
Existing electronic sub-assemblies face challenges in securely embedding power-electronics components without prior electrical connections, leading to potential warping and vulnerability at connection points, and require additional steps like soldering or gluing, which can compromise positioning accuracy and increase thermal resistance.
Innovation Solution
A method involving a symmetrical layered structure where components are mounted on a slightly heated, insulating layer, with a 'shadow mask' or hole mask providing a recess to secure and position the component, eliminating the need for soldering or gluing and ensuring low thermal resistance and low-ohmic connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If components are mounted using soldering, sintering or gluing, then electrical connection is achieved, but additional work steps are required and vulnerability at connection points increases
Solution Approach 1:
The patent merges the electrical connection function with the mechanical mounting function by integrating direct electrical contact between the component and the printed circuit board through the insulating layer, eliminating the need for separate soldering or gluing steps and removing vulnerable intermediate connection points
Solution Approach 2:
The patent extracts and eliminates the intermediate connection elements (solder joints, glue layers) from the assembly process, creating a direct connection path between the component and the circuit board that reduces both complexity and vulnerability
2Device complexity
If components are mounted on a slightly heated insulating layer, then additional connection steps are eliminated, but positioning accuracy may be lost during lamination
Solution Approach 1:
The patent applies preliminary action by heating the insulating layer before component mounting to create a temporarily softened state that facilitates precise component placement, then allows the layer to re-harden to secure the component in its exact position during subsequent lamination
Solution Approach 2:
The patent utilizes parameter changes by temporarily altering the temperature and physical state of the insulating layer from hard to softened during mounting, then back to hard during lamination, enabling both precise positioning and secure fixation without additional connection steps
3Ease of manufacture
If asymmetrical layer structure is used for component embedding, then manufacturing is simplified, but differences in tension cause thin components to warp
Solution Approach 1:
The patent intentionally introduces asymmetry in the form of a recess in the insulating layer at the component location, which compensates for the asymmetrical thermal and mechanical fields during lamination, preventing warping while maintaining overall manufacturing simplicity
Solution Approach 2:
The patent applies local quality by creating a recess specifically at the component mounting location in the insulating layer, providing localized support and thermal management exactly where needed, while the rest of the layer structure remains simple and easy to manufacture
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach securely embeds components with reduced vulnerability and thermal resistance, maintaining positioning accuracy and simplifying the manufacturing process by eliminating additional connection steps, while allowing for symmetrical layering and efficient heat dissipation.
Implementation Method 1
A sufficient securing of the mounted component is achieved, at least in the area below the component, by the temporary liquefaction and subsequent re-hardening (curing) of the electrically insulating layer.
Implementation Method 2
In addition, this layer is used for creating a low-resistance heat sink path, as well as for providing a low-ohmic connection from the component to the high-current path.
Implementation Method 3
This is achieved by mounting the component in a slightly heated state directly onto an electrically insulating layer.
Data Source
AI summary
An electronic sub-assembly (36) comprising at least one electronic component (14) embedded in a sequence of layers, wherein the electronic component (14) is arranged in a recess of an electrically conductive central layer (16) and directly adjoins a resin layer (12, 20) on each side.