Package Vias with Conductive Polymer for ESR Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Components with low effective series resistance (ESR) lead to underdamped responses in power delivery applications, necessitating higher ESR components, but these are expensive and not widely adopted due to cost constraints.
Innovation Solution
Increasing ESR by using package vias with controlled resistivity, achieved through laser drilling and filling with conductive polymers, allowing for the creation of higher ESR components at a lower cost by adding resistance in series or parallel with existing components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high ESR components are used to damp power delivery circuits, then power delivery performance is improved, but component cost increases significantly
Solution Approach 1:
The invention divides the ESR function into two separate components: the decoupling capacitor (providing low ESR for high-frequency performance) and the package via (providing controlled higher ESR for damping). This segmentation allows each component to be optimized independently, achieving the damping effect without requiring expensive high-ESR capacitors.
Solution Approach 2:
The package via acts as an intermediary element between the capacitor and the power delivery network. By controlling the via's resistivity through material selection and dimensional design, it introduces the necessary ESR into the circuit to damp resonances, thereby mediating between the low-ESR capacitor and the system's damping requirements.
2Ease of manufacture
If low ESR components are used, then component cost is reduced, but power delivery circuit damping is insufficient
Solution Approach 1:
The invention changes the resistance parameter of the package via by controlling its physical dimensions (diameter, length) and material composition (conductive polymer, metal fillers, resin matrix). This parameter adjustment allows the via to provide the necessary ESR for circuit damping while maintaining compatibility with standard low-ESR capacitors.
3Ease of manufacture
If conventional via filling materials are used, then manufacturing process is simple, but ESR control precision is insufficient
Solution Approach 1:
The invention employs composite filling materials consisting of conductive polymers with metal fillers (such as silver, copper, or nickel particles) suspended in a resin matrix. This composite structure provides both the ease of via filling (through the polymer's flow properties) and precise ESR control (through the conductive network formed by metal particles), achieving a balance between manufacturability and performance precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the creation of components with increased ESR at a fraction of the cost of high ESR components, effectively damping power circuits and improving power delivery performance without the expense of traditional high ESR components.
Implementation Method 1
a first conductive polymer with a resistance greater than a resistance of the electrical connection circuitry filling the first via hole
Implementation Method 2
laser drilling and filling with conductive polymers
Data Source
AI summary
Discussed generally herein are methods and devices for altering an effective series resistance (ESR) of a component. A device can include a substrate including electrical connection circuitry therein, a first via hole through a first surface of the substrate and contiguous with the electrical connection circuitry, a first conductive polymer with a resistance greater than a resistance of the electrical connection circuitry filling the first via hole, and a component electrically coupled to the first conductive polymer.