PCB Alignment Features Offset LED Misalignment
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Solution Overview
Problem
Conventional techniques for attaching LEDs to a printed circuit board (PCB) often result in misalignment due to process tolerances, leading to sub-optimal operational conditions and non-ideal beam characteristics in applications like automobile headlights.
Innovation Solution
The method involves forming alignment features on the PCB that can be modified based on the position of the LEDs, using a modifying component such as a metal ring with a smaller opening to precisely align the PCB with a support surface and secondary optics, thereby offsetting any misalignment of the LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional techniques are used to attach LEDs to a PCB, then the manufacturing process is simple and fast, but the alignment precision between LEDs and secondary optics deteriorates due to process tolerances
Solution Approach 1:
The patent applies preliminary action by providing PCBs with pre-formed alignment features (such as mounting holes or alignment marks) before LED mounting. These alignment features are designed in advance to compensate for expected process tolerances, allowing the PCB to be pre-positioned relative to secondary optics before LEDs are attached, thereby ensuring final alignment precision without adding complex real-time adjustment mechanisms
Solution Approach 2:
The patent uses alignment features as intermediary elements between the PCB and secondary optics. These intermediate features (mounting holes, alignment marks, or dedicated alignment structures) serve as mediators that facilitate precise positioning and alignment, decoupling the LED mounting process from the alignment requirement and allowing independent optimization of both functions
2Loss of energy
If conventional PCB mounting techniques are used, then the manufacturing process is simple, but the light emission efficiency deteriorates due to misalignment with secondary optics
Solution Approach 1:
The patent implements feedback by using alignment features that provide reference information for positioning the PCB relative to secondary optics. The alignment features (such as visual marks or mechanical references) enable measurement and adjustment of PCB position, allowing correction of misalignment to ensure optimal light emission efficiency while maintaining a relatively simple manufacturing process
3Manufacturing precision
If alignment features are added to the PCB to improve alignment precision, then the alignment tolerance is reduced to less than 100 microns, but the manufacturing complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the alignment function into separate, dedicated alignment features on the PCB, distinct from the LED mounting structures. This segmentation allows the alignment features to be designed and manufactured independently using standard PCB fabrication techniques, achieving high alignment tolerance (less than 100 microns) without significantly complicating the overall manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures precise alignment of LEDs with secondary optics, achieving an alignment tolerance of less than 100 microns and optimal beam emission characteristics.
Implementation Method 1
the light emitted from the LEDs may not optimally or efficiently reach secondary optics
Implementation Method 2
A position of the LED mounted on the PCB may be optically sensed
Data Source
AI summary
LEDs for an illumination system may be mounted on a PCB. The PCB may be provided with alignment features such as oversized holes for connection to a support surface. Using optical sensing of the position of the mounted LEDs, the space made available by the alignment features may be reduced and aligned to create modified alignment features. The modified alignment features may be created by adding a modifying component and aligned based on the sensed positions of the mounted LEDs. The positioning of the modifying component may offset misalignment of the LEDs with the PCB. An opening in the modified alignment feature may receive a bolt or alignment pin for connection to the support surface. The support surface may be aligned with the secondary optics, resulting in the LEDs being aligned with the secondary optics irrespective of misalignment of the LEDs with respect to the PCB.