Electronic Component Mounting Position Correction via Solder Deviation Data
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Solution Overview
Problem
In electronic component mounting systems where multiple substrates are held on a carrier, existing inspection methods fail to accurately determine and correct the mounting position deviations, leading to inefficiencies in the component mounting process.
Innovation Solution
An electronic component mounting system and method that includes a print inspection apparatus capable of recognizing carrier and substrate marks, calculating solder position deviations, and generating position correction data to accurately correct the mounting positions of electronic components on individual substrates held on a carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a plurality of individual substrates are held on a carrier for collective component mounting, then productivity is improved through batch processing, but manufacturing precision deteriorates due to position variations of substrates on the carrier
Solution Approach 1:
The patent applies preliminary action by performing mark position recognition and solder position deviation calculation before the component mounting process. The inspection apparatus detects the actual positions of substrates on the carrier and calculates deviation data in advance, allowing the component mounting apparatus to pre-correct mounting positions based on this deviation information, thereby ensuring accurate component placement despite substrate position variations
Solution Approach 2:
The patent implements feedback by using the mark position recognition portion to detect actual substrate positions, comparing them with predetermined positions, and using this feedback information to calculate solder position deviations. This feedback loop enables dynamic adjustment of mounting positions to compensate for substrate placement variations on the carrier
2Manufacturing precision
If mark position recognition is performed to detect substrate position variations, then manufacturing precision is improved, but device complexity increases due to additional inspection apparatus
Solution Approach 1:
The patent applies universality by designing the mark position recognition portion to serve multiple functions: it recognizes carrier recognition marks to determine carrier position, recognizes substrate recognition marks to determine individual substrate positions, and provides this position information to both the inspection apparatus for deviation calculation and the component mounting apparatus for mounting position correction
Solution Approach 2:
The patent uses mark recognition results as an intermediary that bridges the inspection apparatus and component mounting apparatus. The mark position recognition portion acts as a mediator that provides common position information to both systems, enabling coordinated operation without requiring complex direct communication between the apparatuses
3Manufacturing precision
If solder position deviation calculation is performed for each individual substrate, then manufacturing precision is improved, but loss of time increases due to detailed inspection requirements
Solution Approach 1:
The patent applies segmentation by calculating solder position deviations individually for each substrate rather than treating all substrates uniformly. The solder position deviation calculating portion processes each substrate's mark positions and solder positions separately, enabling precise deviation calculation for each substrate while maintaining efficient batch processing of multiple substrates on the carrier
Data Source
AI summary
In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.