Electronic Card Annular Member for Solder Bump Protection
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Solution Overview
Problem
Existing electronic cards face issues where a thicker heat transfer sheet or narrower gap between the first and second ceiling portions can apply a load to solder bumps, potentially damaging them during the assembly process.
Innovation Solution
The electronic card design incorporates an annular member with a filling material between the first and second ceiling portions, which absorbs variations in gap size and prevents the heat sink from being pressed onto the solder bumps, using a flexible tape material and through-holes for filling and air venting to maintain cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thicker heat transfer sheet is used to improve cooling efficiency, then heat dissipation performance is improved, but a load is applied to solder bumps potentially damaging them
Solution Approach 1:
The patent introduces a cushioning member (elastically deformable member) between the heat transfer sheet and the solder bumps to absorb excess pressing force. This cushioning element prevents the heat transfer sheet from directly transmitting damaging loads to the solder bumps while still maintaining adequate thermal contact, thus resolving the contradiction between cooling efficiency and solder bump integrity.
2Volume of moving object
If the gap between first and second ceiling portions is narrowed to improve compactness, then device size is reduced, but load on solder bumps increases
Solution Approach 1:
The cushioning member is positioned to absorb pressing forces that would otherwise be transmitted to the solder bumps when the gap is narrowed. This allows the device to maintain a compact form factor while protecting the solder bumps from excessive mechanical stress through the elastic deformation of the cushioning element.
3Temperature
If pressing force is increased to improve thermal contact, then heat transfer efficiency is improved, but deformation of components occurs
Solution Approach 1:
The cushioning member provides a compliant interface that allows adequate pressing force to be applied for thermal contact while preventing excessive force that would cause deformation. The elastically deformable nature of the cushioning member enables it to absorb the excess force and maintain optimal contact pressure without transmitting damaging loads to the electronic components.
4Temperature
If heat transfer sheet thickness is increased to improve cooling, then thermal performance is improved, but air gaps and air introduction occur
Solution Approach 1:
The cushioning member acts as a flexible element that conformally contacts the heat transfer sheet and sealing surfaces, preventing air gap formation and air introduction. This flexible sealing mechanism maintains airtightness while accommodating variations in heat transfer sheet thickness and surface irregularities, thus resolving the contradiction between thermal performance and airtightness.
Data Source
AI summary
An electronic card includes a substrate, an electronic device bonded to the substrate via a solder bump, and configured to include a first ceiling, and a cover fixed to the substrate, provided over the electronic device, and configured to include a second ceiling that faces the first ceiling, wherein the first ceiling or the second ceiling is provided with an annular member extending in a facing direction of the first ceiling and the second ceiling, the annular member forming an annular shape along a circumferential direction of the first ceiling, wherein the first ceiling and the second ceiling form a gap between the first ceiling and the second ceiling filled with a filling material inside the annular member, and wherein the second ceiling includes a through hole at a position that overlaps the filling material when viewed in a plan view of the second ceiling.