Stressed Glass Substrate for Tamper-Proof Electronic Packages
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Solution Overview
Problem
Current tamper-proof electronic packaging technologies do not adequately protect sensitive encryption and decryption modules from physical intrusion and unauthorized access, as they rely on sensors that can be compromised by advanced attacks, and there is a need for enhanced security measures to ensure the integrity and confidentiality of cryptographic modules, especially in environments where physical security is a concern.
Innovation Solution
A tamper-proof electronic package is developed using a glass substrate with a compressively-stressed surface layer, where the glass enclosure fragments upon attempted intrusion, physically destroying the electronic components and triggering an erase circuit to secure sensitive information, combined with a tamper-respondent sensor system that monitors the structural integrity of the glass to detect and respond to tampering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional tamper-proof packaging with sensors is used, then security monitoring is provided, but the sensors can be compromised by advanced attacks
Solution Approach 1:
The patent replaces electronic sensor systems with a mechanical fragmentation system. Stressed glass substrates and enclosures are designed to fragment automatically upon intrusion attempts, physically destroying electronic components and triggering erasure circuits through mechanical action rather than electronic sensing, thereby eliminating sensor vulnerability to electronic attacks
Solution Approach 2:
The patent converts the harmful effect of intrusion attempts into beneficial security action. The mechanical stress in the glass is intentionally designed so that any intrusion attempt causes fragmentation, which in turn destroys cryptographic modules and triggers erasure, turning the attacker's force into the security mechanism itself
2Reliability
If glass substrates with electronic components are used, then secure volume is defined, but physical intrusion must be detected and responded to
Solution Approach 1:
The patent applies preliminary action by pre-stressing the glass substrates during manufacturing. The glass is put into compression and equipped with fragmentation trigger elements before assembly, so that no complex detection system is needed - any intrusion automatically triggers fragmentation and component destruction through the pre-configured mechanical stress state
Solution Approach 2:
The stressed glass system provides self-service security functionality. The glass substrates and enclosures automatically fragment and destroy electronic components upon intrusion without requiring external sensors, power sources, or control systems, eliminating the need for complex intrusion response infrastructure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents unauthorized access by ensuring that any physical intrusion results in the destruction of the electronic components and immediate erasure of sensitive information, thereby maintaining the highest level of security as per NIST FIPS 140-2 standards, even in physically unprotected environments.
Implementation Method 1
the glass substrate including stressed glass with a compressively-stressed surface layer
Implementation Method 2
the glass substrate fragments with an attempted intrusion event into the tamper-proof electronic package, and the fragmenting of the glass substrate also fragments the at least one electronic component secured thereto, destroying the at least one electronic component
Implementation Method 3
the at least one electronic component being adhesively coupled to an inner surface of the glass enclosure
Data Source
AI summary
Tamper-proof electronic packages and fabrication methods are provided which include a glass substrate. The glass substrate is stressed glass with a compressively-stressed surface layer. Further, one or more electronic components are secured to the glass substrate within a secure volume of the tamper-proof electronic package. In operation, the glass substrate is configured to fragment with an attempted intrusion event into the electronic package, and the fragmenting of the glass substrate also fragments the electronic component(s) secured to the glass substrate, thereby destroying the electronic component(s). In certain implementations, the glass substrate has undergone ion-exchange processing to provide the stressed glass. Further, the electronic package may include an enclosure, and the glass substrate may be located within the secure volume separate from the enclosure, or alternatively, the enclosure may be a stressed glass enclosure, an inner surface of which is the glass substrate for the electronic component(s).