Patterned Substrate Wetting Control for SMT Adhesive Stability
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Solution Overview
Problem
The existing SMT technology for electronic packaging faces challenges in achieving stable and efficient high-quality production due to issues with solder defects, primarily related to solder-paste printing, dispensing technique, and dot control, which affect the accuracy and reliability of solder joint structures.
Innovation Solution
A conducting package structure and manufacturing method that utilize a substrate with a patterned conducting structure, where the surface is treated to conform to the Wenzel model, enhancing the specific surface area and controlling the wetting angle of the glue material, thereby stabilizing the adhesive material and accelerating solvent volatilization to ensure precise positioning and high yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If SMT technology is used for electronic packaging, then the size of the electronic device is reduced and through holes are eliminated, but solder defects occur and the stability of the solder joint structure is compromised
Solution Approach 1:
The patent changes the physical and chemical parameters of the substrate surface by creating a patterned surface with specific wetting angle characteristics. This modifies how solder paste interacts with the substrate, improving solder joint stability without requiring through holes, thus maintaining the SMT advantage of reduced device size while solving solder reliability issues
Solution Approach 2:
The patent applies local quality by creating a patterned surface with specific regions having controlled wetting angles. Different areas of the substrate surface are engineered to have specific adhesive properties, ensuring proper solder distribution and joint formation only where needed, thereby improving solder joint stability while maintaining compact device design
2Manufacturing precision
If the component placement process is optimized for accuracy, then the adherence accuracy improves, but the process complexity and debugging time increase
Solution Approach 1:
The patent implements preliminary action by pre-patternning the substrate surface with specific wetting angle characteristics before component placement. This pre-prepared surface geometry automatically guides the adhesive material to the correct positions and shapes, eliminating the need for complex real-time control during assembly and reducing debugging requirements
3Reliability
If the reflow process is optimized for stability, then the reliability of solder joint structure is improved, but the production time and process complexity increase
Solution Approach 1:
The patent changes the surface energy parameters of the substrate to create optimal wetting conditions for the adhesive material. This parameter modification ensures that the adhesive spreads and cures predictably during the reflow process, achieving reliable solder joints with standardized reflow parameters and without requiring extended processing times
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high stability and accuracy in electronic device assembly by controlling the shape and position of the adhesive material, reducing deviations and increasing production efficiency and yield.
Implementation Method 1
a wetting angle between the glue material and the patterned surface is determined by the patterned surface
Implementation Method 2
accelerating solvent volatilization
Data Source
AI summary
A strip for an electronic device senses a liquid sample. The strip includes a substrate having a first surface, a plurality of protrusions disposed on the first surface, and each having a width, and a hydrophilic layer having a layer surface disposed on the first surface and the plurality of protrusions, and having a second surface opposite to the layer surface, whereby the liquid sample and the second surface have a contact angle therebetween ranging from 2 to 85 degrees when the liquid sample is disposed on the hydrophilic layer.