Stacked Spacer Unit for Substrate Distance and Pad Pitch
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increase in height of electronic components within semiconductor packages leads to enlarged copper core solder balls, which in turn widen the minimum pitch between solder balls, making it difficult to miniaturize wiring patterns and narrow the pitch between connection pads on substrates.
Innovation Solution
An electronic component incorporated substrate design featuring a spacer unit with a stacked structure of a cored solder ball, a metal post, and another cored solder ball, allowing for reduced dimensions and narrowed pitch between spacer units, enabling miniaturization of wiring patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the height of electronic components is increased, then the distance between upper and lower substrates is increased, but the diameter of copper core solder balls is enlarged and the pitch between connection pads is widened
Solution Approach 1:
The spacer unit transitions from a single spherical solder ball to a stacked structure extending in the vertical dimension. By stacking multiple solder balls with a metal post in between, the spacer achieves greater height (distance between substrates) while maintaining a compact lateral footprint, thus reducing the pitch between connection pads.
Solution Approach 2:
The single spacer unit is segmented into multiple components: first solder ball, metal post, and second solder ball stacked vertically. This segmentation allows the spacer to achieve the required height while minimizing the lateral space occupied, enabling narrower pitch between connection pads.
2Length of stationary object
If the diameter of copper core solder balls is enlarged, then the distance between substrates is increased, but the minimum pitch between solder balls is widened
Solution Approach 1:
The spacer unit extends in the vertical dimension by stacking components, achieving greater substrate distance without increasing lateral dimensions. This dimensional transition allows smaller pitch between solder balls while maintaining adequate spacer height.
3Area of stationary object
If wiring patterns are miniaturized between substrates, then the pitch between connection pads is narrowed, but it becomes difficult to maintain adequate distance between substrates
Solution Approach 1:
The stacked spacer structure utilizes the vertical dimension to maintain adequate substrate distance while allowing lateral compression for narrower pitch between connection pads. This enables wiring pattern miniaturization without compromising substrate spacing.
Solution Approach 2:
The segmented stacked structure achieves compact lateral footprint while maintaining sufficient vertical height, enabling both narrow pitch and adequate substrate distance simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces the pitch between spacer units, facilitating the miniaturization of wiring patterns and maintaining a specified distance between substrates, even with increased electronic component heights.
Implementation Method 1
Solder reflow is performed under a situation in which copper core solder balls are arranged between connection pads of the upper substrate and connection pads of the lower substrate. This solder-bonds the connection pads of the upper substrate and the connection pads of the lower substrate. When the solder melts, the copper core balls are held between the connection pads
Data Source
AI summary
An electronic component incorporated substrate includes a first substrate and a second substrate electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. A first encapsulating resin is formed between the first substrate and the second substrate to encapsulate the electronic component. A second encapsulating resin is formed on a first surface of the first encapsulating resin to fill a space between the first encapsulating resin and the second substrate. The spacer unit includes a stacked structure of a first solder ball, a metal post, and a second solder ball stacked in a stacking direction of the first substrate and the second substrate.