Embedded Substrate Insulation Walls for Capacitor Short Prevention
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Solution Overview
Problem
Existing electronic component-embedded substrates face issues with electric shorts due to contact between adjacent capacitors' connection terminals, especially when capacitors are inclined or positionally deviated, and the insulation wall portions formed from the core substrate lack sufficient strength and flexibility for dense mounting arrangements.
Innovation Solution
A novel electronic component-embedded substrate design featuring a core substrate with a penetrating cavity divided into component embedding areas by a support pattern, where insulation wall portions made of the same material as the core substrate are arranged on the support pattern to prevent capacitor contact and provide structural reinforcement, allowing for reduced wall thickness without compromising strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulation wall portions are formed from the core substrate to prevent capacitor contact, then electric short prevention is improved, but the wall thickness must be increased to ensure sufficient strength
Solution Approach 1:
The patent applies composite materials by combining the core substrate material with a separate insulation material to form the insulation wall portions. This composite structure allows the wall to provide both mechanical strength (from the core substrate material) and electrical insulation (from the insulation material), enabling thinner walls that maintain sufficient strength while preventing electric shorts between adjacent capacitors.
2Productivity
If capacitors are arranged densely in the cavity to improve mounting density, then productivity is improved, but the risk of electric short between adjacent capacitors increases
Solution Approach 1:
The patent introduces insulation wall portions as intermediary structures between adjacent capacitors. These wall portions act as mediators that physically separate the capacitors and prevent direct contact between their connection terminals, thereby enabling dense mounting arrangements while maintaining reliable electric short prevention through the insulating barrier.
3Volume of stationary object
If insulation wall portions are made thinner to reduce cavity space, then volume is improved, but structural strength and stability deteriorate
Solution Approach 1:
The patent uses composite materials consisting of the core substrate material combined with insulation material to create insulation wall portions. This composite construction provides enhanced structural strength and stability compared to single-material walls, allowing the walls to be made thinner for better space utilization while maintaining the necessary mechanical integrity to support dense capacitor arrangements.
Data Source
AI summary
An electronic component-embedded substrate includes a core substrate, a cavity penetrating the core substrate, a wiring layer formed on one surface of the core substrate, a support pattern extending over the cavity and configured to divide the cavity into a plurality of component embedding areas, an insulation wall portion arranged on a part of the support pattern in the cavity and formed of the same material as the core substrate, a plurality of electronic components each of which is mounted in each of the plurality of component embedding areas, and an insulating material filling an inside of the cavity.